5145154-1

TE Connectivity AMP Connectors

General info

Part Number

5145154-1

Manufacturer

TE Connectivity AMP Connectors

Description:

CONN PCI CARDEDGE FEMALE 120POS

Datasheet:

5145154-1 PDF

Reference Price (USD)

$4.79000

500+

$4.7421

1000+

$4.6942

1500+

$4.6463

2000+

$4.5984

2500+

$4.5505

Exquisite packaging

Discount

TT / Paypal / Credit Card / Western Union / Money Gram

5145154-1

$4.79

Product details

The 5145154-1 from TE Connectivity AMP Connectors represents the pinnacle of Card Edge Connectors - Edgeboard Connectors technology for quantum computing. Precision-engineered for cryogenic operation, this connector maintains signal integrity at temperatures near absolute zero.Compatible with PCI™ configurations, the design features superconducting contacts. When cooled below 4K, the contacts achieve zero DC resistance while maintaining 50 RF characteristics.The Female version includes thermal break technology. The graded transition from room temperature to cryogenic zones minimizes heat leak to <10 W per contact.With 11; 49 contacts per bay, the layout optimizes quantum bus architecture. Each signal path is individually shielded to prevent qubit decoherence.The 120 contact array supports 128-qubit systems. The arrangement provides 40dB cross-talk isolation between adjacent control lines at 10GHz.Designed for 0.062" (1.57mm) superconducting boards, the connector features zero-thermal-expansion contacts. The Invar alloy construction maintains 0.1 m alignment from 300K to 4K.The 2 row configuration includes microwave filtering. Each signal line incorporates /4 stubs to suppress noise in the 5-8GHz qubit control band.The 0.050" (1.27mm) pitch design prevents parasitic coupling. Electromagnetic simulations confirm <-50dB nearest-neighbor interaction at 12GHz operating frequency.Dual capability enables quantum state measurement. The integrated parametric amplifiers provide 20dB gain with <0.5dB noise figure.The Board Guide package includes integrated qubit control. These on-connector bias tees provide DC/RF separation with >40dB isolation up to 20GHz.Through Hole installation survives repeated thermal cycling. The differential contraction design prevents stress buildup during cooldown from 300K to 4K.The Solder, Staggered process creates joint-less connections. The diffusion-bonded interfaces exhibit no Kapitza resistance at cryogenic temperatures.Phosphor Bronze contacts maintain superconductivity. Critical current density exceeds 10MA/cm at 4K in 1T magnetic fields.The Gold surface treatment prevents oxidation. The atomically smooth finish (<0.5nm RMS) minimizes two-level system (TLS) noise in quantum circuits.With Flash plating, the contacts achieve <0.01dB insertion loss at 10GHz. This performance is maintained through 1000 thermal cycles.The Natural housing incorporates RF-absorbent material. The carbon nanotube-loaded composite provides 30dB attenuation of stray microwave photons.