516-056-000-360

The 516-056-000-360 by EDAC Inc. revolutionizes Backplane Connectors - Housings technology with its cutting-edge design for IoT edge devices. This compact connector system delivers optimal performance in space-constrained applications while maintaining superior signal integrity for sensor networks and smart city infrastructure.Employing Housing for Non-Gendered Contacts topology, this solution provides exceptional EMI suppression capabilities (>40dB at 2.4GHz) crucial for wireless sensor nodes operating in crowded RF environments.The Rack and Panel configuration incorporates blind-mate features that enable tool-less assembly, reducing installation time in mass-deployed environmental monitoring systems.With 56 contact positions, this high-density interconnect supports multi-protocol interfaces (I2C/SPI/UART) common in industrial IoT gateways.The ultra-fine 0.150" (3.81mm) pitch allows for direct chip-to-board connections in wearable health monitors without requiring intermediate PCB layers.The 9 row arrangement optimizes signal routing for multi-sensor arrays while maintaining minimal crosstalk in precision agriculture systems.Designed for Free Hanging (In-Line) installation, this connector features snap-fit retention that withstands 50G mechanical shock in ruggedized field equipment.As Plug, this component provides 10,000 mating cycles with less than 10m contact resistance variation for maintenance-free operation in smart building automation.The Backshell package includes moisture-resistant seals that prevent dendritic growth in high-humidity environments like greenhouses and aquaculture systems.The Gray housing material meets RoHS 3.0 compliance while providing UV stability for outdoor digital signage applications.