519-014-501-360
EDAC Inc.
519-014-501-360
EDAC Inc.
519 SERIES RACK & PANEL CONNECTO
Reference Price (USD)
1+
$45.38400
500+
$44.93016
1000+
$44.47632
1500+
$44.02248
2000+
$43.56864
2500+
$43.1148
Exquisite packaging
Discount
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519-014-501-360
$45.38
Product details
The 519-014-501-360 by EDAC Inc. revolutionizes Backplane Connectors - Specialized technology, specifically engineered for hyperscale data center applications. This high-density interconnect solution delivers unmatched signal integrity while supporting next-generation computing architectures.Specifically developed for Backplane implementations, this series excels in co-packaged optics interconnect applications.Featuring Plug, Hermaphroditic Contacts configuration, this connector series provides optimal performance for 224G PAM4 signaling in switch fabric applications.The Rack and Panel design incorporates advanced crosstalk suppression techniques, critical for maintaining eye diagram integrity in high-speed serial links.With 14 available positions, this solution enables unprecedented port density for top-of-rack switching equipment.The All loaded variant offers power-efficient solutions for partial population scenarios in server backplanes.The 0.150" (3.81mm) micro-pitch design enables breakthrough density while maintaining impedance control for 112G SerDes channels.3 row configuration supports orthogonal direct-attach copper architectures in disaggregated server designs.The 6 column architecture enables efficient routing of wide parallel buses in memory-centric computing systems.Free Hanging (In-Line) installation method ensures precise coplanarity for reliable surface-mount assembly in automated PCB production lines.The Solder process has been optimized for low-void solder joints in mass reflow processes per IPC-7095C standards.Key Backshell include integrated heat spreaders and airflow-optimized housings for thermal management in high-performance computing applications.Gold plating technology provides superior wear resistance exceeding 10,000 mating cycles for data center hot-swap scenarios.10.0µin (0.25µm) coating thickness ensures compliance with IEC 60512-99-001 fretting corrosion requirements.The Gray housing material incorporates laser-markable surfaces for traceability in automated manufacturing environments.
Product Attributes
- Product Status: Active
- Connector Usage: Backplane
- Connector Type: Plug, Hermaphroditic Contacts
- Connector Style: Rack and Panel
- Number of Positions: 14
- Number of Positions Loaded: All
- Pitch: 0.150" (3.81mm)
- Number of Rows: 3
- Number of Columns: 6
- Mounting Type: Free Hanging (In-Line)
- Termination: Solder
- Contact Layout, Typical: -
- Features: Backshell
- Contact Finish: Gold
- Contact Finish Thickness: 10.0µin (0.25µm)
- Color: Gray
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