532436-5
TE Connectivity AMP Connectors
532436-5
TE Connectivity AMP Connectors
CONN HEADER HD 160POS PCB
Reference Price (USD)
1+
$40.82321
500+
$40.4149779
1000+
$40.0067458
1500+
$39.5985137
2000+
$39.1902816
2500+
$38.7820495
Exquisite packaging
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532436-5
$40.82
Product details
The 532436-5 from TE Connectivity AMP Connectors represents a cutting-edge solution in Backplane Connectors - Specialized, engineered for high-density backplane applications requiring exceptional signal integrity. This advanced connector system combines robust construction with precision engineering to deliver reliable performance in mission-critical environments.With Header, Male Pins configuration, this component ensures optimal mating compatibility while maintaining superior electrical characteristics. The hermaphroditic contact design enhances assembly flexibility in complex systems.Featuring High Density (HDC, HDI, HPC) technology, the connector achieves industry-leading contact reliability, particularly beneficial for high-vibration environments found in industrial automation equipment.The 160 position count provides exceptional scalability for backplane architectures, enabling designers to implement modular system designs with simplified interconnect schemes.When configured with All loaded positions, the connector offers customizable solutions for power distribution networks without compromising signal path density.With 0.100" (2.54mm) centerline spacing, the design achieves optimal balance between high-density packaging and manufacturability requirements.The 4 row configuration enables three-dimensional backplane stacking, particularly valuable in data center orthogonal interconnect architectures.The Through Hole mounting option facilitates both standard and high-reliability PCB attachment methods, with proven performance in through-hole reflow processes.Solder methods provide flexibility for both automated assembly processes and field-serviceable connections in telecom infrastructure.Incorporating Mating Guide, this connector system addresses EMI shielding requirements while providing positive latching mechanisms essential for vibration-resistant installations.Gold plating ensures durable contact surfaces capable of withstanding multiple mating cycles, meeting MIL-STD-202H standards for harsh environment operation.The 30.0µin (0.76µm) coating thickness exceeds industry standards for corrosion resistance, ensuring long-term reliability in humid operating conditions.The Black housing material complies with UL94V-0 flammability ratings while providing visual differentiation for complex cabling systems.
Product Attributes
- Product Status: Active
- Connector Usage: -
- Connector Type: Header, Male Pins
- Connector Style: High Density (HDC, HDI, HPC)
- Number of Positions: 160
- Number of Positions Loaded: All
- Pitch: 0.100" (2.54mm)
- Number of Rows: 4
- Number of Columns: -
- Mounting Type: Through Hole
- Termination: Solder
- Contact Layout, Typical: -
- Features: Mating Guide
- Contact Finish: Gold
- Contact Finish Thickness: 30.0µin (0.76µm)
- Color: Black
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