533094-3
TE Connectivity AMP Connectors
533094-3
TE Connectivity AMP Connectors
CONN HEADER HD 423POS PCB
Reference Price (USD)
1+
$84.29625
500+
$83.4532875
1000+
$82.610325
1500+
$81.7673625
2000+
$80.9244
2500+
$80.0814375
Exquisite packaging
Discount
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533094-3
$84.30
Product details
The 533094-3 by TE Connectivity AMP Connectors revolutionizes Backplane Connectors - Specialized technology, specifically engineered for hyperscale data center applications. This high-density interconnect solution delivers unmatched signal integrity while supporting next-generation computing architectures.Featuring Header, Male Pins configuration, this connector series provides optimal performance for 224G PAM4 signaling in switch fabric applications.The High Density (HDC, HDI, HPC) design incorporates advanced crosstalk suppression techniques, critical for maintaining eye diagram integrity in high-speed serial links.With 423 available positions, this solution enables unprecedented port density for top-of-rack switching equipment.The All loaded variant offers power-efficient solutions for partial population scenarios in server backplanes.The 0.100" (2.54mm) micro-pitch design enables breakthrough density while maintaining impedance control for 112G SerDes channels.3 row configuration supports orthogonal direct-attach copper architectures in disaggregated server designs.Through Hole installation method ensures precise coplanarity for reliable surface-mount assembly in automated PCB production lines.The Press-Fit process has been optimized for low-void solder joints in mass reflow processes per IPC-7095C standards.Key Mating Guide include integrated heat spreaders and airflow-optimized housings for thermal management in high-performance computing applications.Gold plating technology provides superior wear resistance exceeding 10,000 mating cycles for data center hot-swap scenarios.30.0µin (0.76µm) coating thickness ensures compliance with IEC 60512-99-001 fretting corrosion requirements.The Natural housing material incorporates laser-markable surfaces for traceability in automated manufacturing environments.
Product Attributes
- Product Status: Active
- Connector Usage: -
- Connector Type: Header, Male Pins
- Connector Style: High Density (HDC, HDI, HPC)
- Number of Positions: 423
- Number of Positions Loaded: All
- Pitch: 0.100" (2.54mm)
- Number of Rows: 3
- Number of Columns: -
- Mounting Type: Through Hole
- Termination: Press-Fit
- Contact Layout, Typical: -
- Features: Mating Guide
- Contact Finish: Gold
- Contact Finish Thickness: 30.0µin (0.76µm)
- Color: Natural
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