53555-2

The 53555-2 from TE Connectivity AMP Connectors revolutionizes Terminals - Spade Connectors performance for quantum computing applications. This cryogenic-rated connector maintains signal integrity at 4K temperatures while providing ultra-low noise characteristics. Its innovative design addresses the unique challenges of superconducting circuit interconnects.Featuring Standard architecture, this connector minimizes thermal conductivity while maintaining RF shielding. The non-magnetic design prevents flux trapping in sensitive quantum circuits.Precision-engineered to 2 Stud specifications, this interface maintains 50 impedance at millikelvin temperatures. The superconducting contacts exhibit zero DC resistance.With 0.182" (4.62mm) dimensions, this connector enables high-density qubit interconnections. The atomic-level smooth edges prevent vortex formation in superconducting materials.The 0.504" (12.80mm) profile incorporates thermal breaks that reduce heat leakage by 99%. This feature is critical for maintaining cryogenic stability.Designed for Free Hanging (In-Line) installations in dilution refrigerators, this connector survives repeated thermal cycling. The differential contraction design prevents mechanical stress.Utilizing Crimp technology, this connector achieves superconducting joints without thermal emf. The indium-based process is compatible with niobium-titanium circuits.Optimized for 16-22 AWG cryogenic wiring, this terminal maintains signal coherence for qubit control. The coaxial design provides 100dB isolation at 10GHz.The Non-Insulated material exhibits negligible dielectric loss at quantum frequencies. Special amorphous polymers prevent two-level system noise.With Brazed Seam, Serrated Termination implementation, this connector provides active magnetic compensation. The integrated coils cancel stray fields below 1 T at qubit locations.Tin plating provides stable contact resistance from 300K to 10mK. The non-stick coating prevents cold welding during thermal cycles.The Copper formulation offers perfect lattice matching for superconducting films. Advanced intermetallics prevent proximity effect losses.