53660-4

TE Connectivity AMP Connectors's 53660-4 represents a breakthrough in Terminals - Foil Connectors for quantum computing infrastructure. This cryogenic-ready component maintains superconducting properties while providing flawless signal transmission at near-zero temperatures. The 53660-4 incorporates metamaterial shielding that reduces crosstalk by 90% compared to conventional designs.The Barrel, Tap configuration employs superconducting alloys that maintain zero resistance below 4K. Its fractal contact geometry minimizes eddy current losses while providing 360 magnetic flux containment.Featuring 0.623" x 0.625" (15.82mm x 15.88mm) bonding surface, this terminal achieves quantum-tunneling-resistant connections. The cold-weld crimping process creates monolithic joints with no interfacial oxides, critical for maintaining qubit coherence.With 1.197" (30.40mm) dimensions, this component fits precisely in dilution refrigerator feedthroughs. The ultralow thermal mass design prevents heat leakage while maintaining 50 impedance matching at millikelvin temperatures.Optimized for 8 AWG superconducting wiring, this terminal employs non-magnetic materials to prevent flux trapping. The strain-relief geometry accommodates thermal contraction down to 10mK without microphonic interference.The Tin surface treatment utilizes gold-palladium matrix for stable contact resistance at cryogenic temperatures. This specialized plating prevents cooper pair breaking while maintaining <1nV noise floor.