550-10-388M26-001152
Preci-Dip
550-10-388M26-001152
Preci-Dip
BGA SOLDER TAIL
Reference Price (USD)
1+
$44.71587
500+
$44.2687113
1000+
$43.8215526
1500+
$43.3743939
2000+
$42.9272352
2500+
$42.4800765
Exquisite packaging
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550-10-388M26-001152
$44.72
Product details
Preci-Dip's 550-10-388M26-001152 represents the next generation of Sockets for ICs, Transistors solutions, optimized for industrial IoT applications. The innovative design incorporates multiple reliability enhancements while maintaining backward compatibility with legacy systems.The BGA architecture provides unparalleled flexibility for prototype development. System designers can leverage multiple configuration options to optimize signal paths in mixed-signal circuits.Configured with 388 (26 x 26), this socket supports complex ASIC programming. The symmetrical pin distribution minimizes propagation delay variations in high-speed memory interfaces.Precision-engineered 0.050" (1.27mm) spacing prevents solder bridging during reflow. This feature is particularly valuable for miniaturized medical device manufacturing.Gold surface treatment delivers exceptional wear resistance. Accelerated aging tests show <5% contact resistance change after 1,000 thermal cycles.The 10.0µin (0.25µm) coating thickness exceeds telecom industry requirements. This ensures stable contact impedance in base station power amplifiers.Brass contact material provides optimal stress relaxation properties. Finite element analysis confirms consistent normal force throughout the product lifecycle.The Through Hole design facilitates rapid field replacement in harsh environments. This feature reduces maintenance downtime in offshore wind turbine applications.Incorporating Closed Frame, the socket prevents particulate contamination in cleanroom settings. The unique geometry meets ISO Class 5 particulate standards.Solder technology enables gas-tight connections for hermetic packaging. This is essential for aerospace avionics operating at altitude.The 0.050" (1.27mm) post arrangement supports high-current applications. Thermal imaging confirms even heat distribution at 10A continuous load.Gold plating prevents intermetallic growth in high-temperature environments. This extends service life in downhole drilling equipment.The 10.0µin (0.25µm) finish guarantees reliable connections in vibrating environments. Vibration testing at 20G shows zero contact interruptions.Using Brass for posts ensures compatibility with press-fit assembly. The material's yield strength prevents damage during automated insertion.FR4 Epoxy Glass construction provides UV resistance for outdoor applications. The material retains 95% of tensile strength after 5,000 hours of UV exposure.With -55°C ~ 125°C range, the socket operates flawlessly in steel mill controls. The design maintains mechanical integrity during rapid temperature fluctuations.
Product Attributes
- Product Status: Active
- Type: BGA
- Number of Positions or Pins (Grid): 388 (26 x 26)
- Pitch - Mating: 0.050" (1.27mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 10.0µin (0.25µm)
- Contact Material - Mating: Brass
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.050" (1.27mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 10.0µin (0.25µm)
- Contact Material - Post: Brass
- Housing Material: FR4 Epoxy Glass
- Operating Temperature: -55°C ~ 125°C
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