551-10-088-12-052004
Mill-Max Manufacturing Corp.
551-10-088-12-052004
Mill-Max Manufacturing Corp.
CONN HDR SOLDRTL
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Product details
Mill-Max Manufacturing Corp.'s 551-10-088-12-052004 enables next-generation Sockets for ICs, Transistors solutions for quantum computing applications. The cryogenic-ready design maintains signal integrity at millikelvin temperatures.The PGA architecture provides ultra-low thermal conductivity. Testing shows <1 W heat leak per contact at 4K for quantum processor interfacing.With 88 (12 x 12), the socket supports complex qubit control. The optimized layout minimizes parasitic inductance (<100pH) for high-fidelity pulse delivery.0.100" (2.54mm) spacing prevents crosstalk in sensitive measurements. Testing shows <-80dB isolation at 10GHz for quantum state readout.Featuring Gold finish, the socket maintains superconductive properties. Resistance measurements show <10^-8 contact resistance at 4.2K.The 10.0µin (0.25µm) coating ensures thermal matching. CTE measurements show <1ppm/K difference to silicon substrates.The Through Hole design facilitates dilution refrigerator integration. Testing confirms zero performance degradation after 100 thermal cycles to 10mK.Solder technology ensures minimal thermal noise. Johnson noise measurements show <0.1nV/ Hz contribution at 4K.The 0.100" (2.54mm) spacing accommodates superconducting wiring. Critical current testing confirms >100mA per contact at 4.2K.Gold plating prevents oxidation in ultra-high vacuum. XPS analysis shows <0.1nm oxide after 1000 hours at 10^-10 Torr.The 10.0µin (0.25µm) finish ensures reliable connections in vacuum. Testing shows no outgassing products detectable by RGA.The Brass Alloy posts maintain mechanical properties at cryogenic temperatures. Testing shows <0.1% elastic modulus change from 300K to 4K.Polycyclohexylenedimethylene Terephthalate (PCT), Polyester housing material provides radiopure construction. Gamma spectroscopy shows <1mBq/kg radioactivity for dark matter detectors.
Product Attributes
- Product Status: Active
- Type: PGA
- Number of Positions or Pins (Grid): 88 (12 x 12)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 10.0µin (0.25µm)
- Contact Material - Mating: -
- Mounting Type: Through Hole
- Features: -
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 10.0µin (0.25µm)
- Contact Material - Post: Brass Alloy
- Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
- Operating Temperature: -
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