551-90-145-15-002003
Mill-Max Manufacturing Corp.
551-90-145-15-002003
Mill-Max Manufacturing Corp.
CONN HDR SOLDRTL
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Product details
The 551-90-145-15-002003 from Mill-Max Manufacturing Corp. delivers laboratory-grade precision for Sockets for ICs, Transistors applications in test and measurement equipment. The ultra-stable design ensures <0.1% measurement uncertainty over 10,000 mating cycles.Featuring PGA configuration, the socket provides 10^14 insulation resistance. Guarded measurements confirm <1pA leakage current at 1000V for sensitive instrumentation.With 145 (15 x 15), the socket supports high-precision metrology. The symmetrical layout minimizes thermocouple effects to <0.1 V/ C.0.100" (2.54mm) spacing achieves optimal noise rejection. Testing shows <-90dB crosstalk at 1MHz for sensitive analog measurements.The Tin-Lead finish provides stable thermoelectric properties. Testing confirms <0.5 V contact potential variation over temperature.200.0µin (5.08µm) thickness ensures long-term stability. Resistance measurements show <10ppm/year drift in controlled environments.The Through Hole design prevents microphonic noise. Testing confirms <1 V vibration-induced noise in sensitive amplifier circuits.Solder technology ensures negligible insertion loss. Network analyzer measurements show <0.01dB loss at 6GHz for RF test applications.The 0.100" (2.54mm) spacing accommodates precision coaxial connections. Testing confirms <0.05mm positional accuracy for microwave probe stations.Tin-Lead plating prevents surface oxidation. XPS analysis shows <1nm oxide growth after 1000 hours in cleanroom environments.The 200.0µin (5.08µm) finish guarantees reproducible connections. Testing shows <0.01% contact resistance variation between mating cycles.The Brass Alloy posts maintain dimensional stability. Interferometer measurements show <10nm flatness variation over temperature.Polycyclohexylenedimethylene Terephthalate (PCT), Polyester housing material provides ultra-low outgassing. RGA testing shows <1 10^-9 Torr total mass loss for vacuum applications.
Product Attributes
- Product Status: Active
- Type: PGA
- Number of Positions or Pins (Grid): 145 (15 x 15)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Tin-Lead
- Contact Finish Thickness - Mating: 200.0µin (5.08µm)
- Contact Material - Mating: -
- Mounting Type: Through Hole
- Features: -
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin-Lead
- Contact Finish Thickness - Post: 200.0µin (5.08µm)
- Contact Material - Post: Brass Alloy
- Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
- Operating Temperature: -
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