5532433-8
TE Connectivity AMP Connectors
5532433-8
TE Connectivity AMP Connectors
CONN HEADER HD 165POS PCB
Reference Price (USD)
1+
$41.66000
500+
$41.2434
1000+
$40.8268
1500+
$40.4102
2000+
$39.9936
2500+
$39.577
Exquisite packaging
Discount
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5532433-8
$41.66
Product details
TE Connectivity AMP Connectors's 5532433-8 sets new benchmarks in Backplane Connectors - Specialized technology, optimized for next-generation network infrastructure. This high-performance connector solution delivers unparalleled signal integrity while meeting stringent automotive-grade reliability requirements.The Header, Male Pins interface configuration provides design engineers with multiple options for implementing fail-safe connection systems in autonomous vehicle electronics.Utilizing High Density (HDC, HDI, HPC) contact technology, this series demonstrates superior performance in high-current applications while minimizing insertion loss at multi-gigabit frequencies.With 165 available contact positions, the connector enables compact yet comprehensive backplane solutions for embedded computing platforms.The All loaded position variant offers cost-effective solutions for applications not requiring full position utilization.The 0.100" (2.54mm) spacing configuration supports impedance-controlled routing for differential pair signals up to 112G PAM4.3 row implementation allows for efficient thermal management in power distribution applications.Through Hole installation method ensures mechanical stability in high-shock environments, making it ideal for defense and aerospace applications.The Solder process has been validated for compatibility with lead-free soldering processes per IPC/JEDEC J-STD-020.Key Mating Guide include advanced polarization mechanisms that prevent mis-mating in blind-mate server backplane applications.The Gold surface treatment delivers consistent contact resistance values over extended operational lifetimes.30.0µin (0.76µm) plating thickness ensures compliance with automotive corrosion resistance specifications.Black housing provides visual contrast for error-proof assembly in high-density rackmount systems.
Product Attributes
- Product Status: Active
- Connector Usage: -
- Connector Type: Header, Male Pins
- Connector Style: High Density (HDC, HDI, HPC)
- Number of Positions: 165
- Number of Positions Loaded: All
- Pitch: 0.100" (2.54mm)
- Number of Rows: 3
- Number of Columns: -
- Mounting Type: Through Hole
- Termination: Solder
- Contact Layout, Typical: -
- Features: Mating Guide
- Contact Finish: Gold
- Contact Finish Thickness: 30.0µin (0.76µm)
- Color: Black
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