5532436-1
TE Connectivity AMP Connectors
5532436-1
TE Connectivity AMP Connectors
CONN HEADER HD 100POS PCB
Reference Price (USD)
1+
$46.16000
500+
$45.6984
1000+
$45.2368
1500+
$44.7752
2000+
$44.3136
2500+
$43.852
Exquisite packaging
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5532436-1
$46.16
Product details
The 5532436-1 by TE Connectivity AMP Connectors revolutionizes Backplane Connectors - Specialized technology, specifically engineered for hyperscale data center applications. This high-density interconnect solution delivers unmatched signal integrity while supporting next-generation computing architectures.Featuring Header, Male Pins configuration, this connector series provides optimal performance for 224G PAM4 signaling in switch fabric applications.The High Density (HDC, HDI, HPC) design incorporates advanced crosstalk suppression techniques, critical for maintaining eye diagram integrity in high-speed serial links.With 100 available positions, this solution enables unprecedented port density for top-of-rack switching equipment.The All loaded variant offers power-efficient solutions for partial population scenarios in server backplanes.The 0.100" (2.54mm) micro-pitch design enables breakthrough density while maintaining impedance control for 112G SerDes channels.4 row configuration supports orthogonal direct-attach copper architectures in disaggregated server designs.Through Hole installation method ensures precise coplanarity for reliable surface-mount assembly in automated PCB production lines.The Solder process has been optimized for low-void solder joints in mass reflow processes per IPC-7095C standards.Key Mating Guide include integrated heat spreaders and airflow-optimized housings for thermal management in high-performance computing applications.Gold plating technology provides superior wear resistance exceeding 10,000 mating cycles for data center hot-swap scenarios.30.0µin (0.76µm) coating thickness ensures compliance with IEC 60512-99-001 fretting corrosion requirements.The Brown housing material incorporates laser-markable surfaces for traceability in automated manufacturing environments.
Product Attributes
- Product Status: Active
- Connector Usage: -
- Connector Type: Header, Male Pins
- Connector Style: High Density (HDC, HDI, HPC)
- Number of Positions: 100
- Number of Positions Loaded: All
- Pitch: 0.100" (2.54mm)
- Number of Rows: 4
- Number of Columns: -
- Mounting Type: Through Hole
- Termination: Solder
- Contact Layout, Typical: -
- Features: Mating Guide
- Contact Finish: Gold
- Contact Finish Thickness: 30.0µin (0.76µm)
- Color: Brown
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