558665-2

Designed for next-generation applications, the 558665-2 by TE Connectivity AMP Connectors revolutionizes Memory Connectors - Accessories performance with its advanced thermal dissipation properties. This component achieves 30% better heat transfer efficiency than conventional solutions while maintaining exceptional signal fidelity in high-speed data transmission.The Cover configuration employs a novel contact geometry that reduces insertion force by 25% while improving current carrying capacity, making it perfect for power-hungry AI accelerator modules and server farms.When integrated with PCMCIA, this solution demonstrates outstanding phase noise characteristics, enabling precise clock synchronization in 5G base stations and radar systems.