56-77-10G
Aavid, Thermal Division of Boyd Corporation
56-77-10G
Aavid, Thermal Division of Boyd Corporation
HEATSINK
Reference Price (USD)
1+
$0.72538
500+
$0.7181262
1000+
$0.7108724
1500+
$0.7036186
2000+
$0.6963648
2500+
$0.689111
Exquisite packaging
Discount
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56-77-10G
$0.73
Product details
Aavid, Thermal Division of Boyd Corporation's 56-77-10G delivers cutting-edge Thermal - Pads, Sheets solutions for next-generation 5G infrastructure. This high-performance thermal interface material addresses the unique thermal management challenges of RF power amplifiers and base station electronics.As a premium Insulator, this product combines exceptional thermal conductivity with excellent EMI shielding properties. This dual functionality simplifies thermal design in sensitive RF applications.Available in precision Round configurations, this material enables optimal thermal pathway design for complex RF modules. The geometrically optimized profiles ensure maximum heat transfer efficiency.Standard 5.20mm Dia sizes accommodate most common power amplifier packaging requirements. The size-optimized design allows for efficient thermal management in space-constrained base station equipment.With precise 0.0030" (0.076mm) control, this material provides predictable interface performance. The uniform cross-section ensures consistent thermal transfer characteristics across the entire contact area.The advanced Mica formulation offers exceptional resistance to high-temperature aging effects. This characteristic ensures long-term reliability in continuous operation scenarios.The Opaque coding system facilitates quick material identification during assembly processes. This feature streamlines production workflows in high-mix manufacturing environments.
Product Attributes
- Product Status: Active
- Usage: -
- Type: Insulator
- Shape: Round
- Outline: 5.20mm Dia
- Thickness: 0.0030" (0.076mm)
- Material: Mica
- Adhesive: -
- Backing, Carrier: -
- Color: Opaque
- Thermal Resistivity: -
- Thermal Conductivity: -
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