5746612-3

The 5746612-3 from TE Connectivity AMP Connectors represents a breakthrough in Rectangular Connectors - Board In, Direct Wire to Board technology for high-speed computing applications. Optimized for signal integrity at multi-gigabit data rates, this connector series enables next-generation server architectures and data center interconnects.The Ribbon Cable, DIP Header design incorporates advanced crosstalk suppression techniques that maintain signal purity at 56Gbps PAM4 signaling, critical for high-performance computing and AI accelerator applications.Available in 16 configurations, this connector family supports the growing bandwidth requirements of server backplanes, from traditional 1U servers to hyper-scale data center architectures.Precision 0.050" (1.27mm) alignment maintains consistent differential pair geometry, critical for minimizing skew in 112G PAM4 signaling used in next-generation data center interconnects.The 0.100" (2.54mm) board interface supports high-density PCB designs with microvia technology, enabling compact routing of 400G Ethernet switch fabrics.The 2-row architecture optimizes signal density while minimizing insertion loss, enabling higher port counts in top-of-rack switches and router line cards.0.300" (7.62mm) separation between rows minimizes far-end crosstalk in server memory interfaces where signal integrity directly impacts system performance.Through Hole mounting ensures reliable connections in vibration-prone data center environments while supporting high-volume automated assembly processes for mass production.Utilizing IDC technology, the connector achieves consistent impedance matching across all contacts, reducing signal reflections in 400G Ethernet and InfiniBand EDR applications.Compatible with 28 AWG, Stranded; 26-30 AWG, Solid wiring, the connector accommodates both high-speed differential pairs and power delivery requirements in blade server systems and storage arrays.The Feed Through include innovative contact geometries that reduce insertion force while maintaining signal integrity, and ESD protection for hot-pluggable server components.Gold plating provides optimal surface properties for high-frequency signal transmission while resisting wear in frequently mated data center applications.With 15.0µin (0.38µm) selective gold plating, the contacts achieve optimal high-frequency performance while controlling costs in high-volume data center applications.The Black housing facilitates quick visual identification in dense server racks while meeting flammability requirements for confined data center environments.