57GF3050050C000100

Laird Technologies EMI's 57GF3050050C000100 redefines excellence in Thermal - Pads, Sheets for mission-critical thermal management. Designed for aerospace and defense applications, this high-reliability solution combines cutting-edge materials science with precision manufacturing processes to deliver unmatched thermal performance.Specifically developed for Thermal Gasket scenarios, this thermal interface excels in extreme environments. Its multi-directional heat transfer capability ensures consistent performance whether used in vertical or horizontal orientations, making it versatile for various assembly configurations.The Graphite-Pad, Sheet construction provides exceptional dielectric strength while maintaining thermal efficiency. This dual functionality makes it particularly valuable in high-voltage applications where electrical isolation is as crucial as thermal management.Precision-engineered in Rectangular formats, this product enables optimal thermal pathway design. The geometrically optimized profiles minimize thermal impedance while maximizing contact area with heat-generating components.Available in 300.00mm x 5.00mm sizes, this solution accommodates both large-area cooling and localized hot spot management. The standardized dimensions ensure compatibility with common heat sink designs and mounting patterns.With a controlled 0.197" (5.00mm) tolerance, this material provides predictable thermal performance. The uniform cross-section guarantees consistent interface pressure across the entire contact surface.The proprietary Copper - Graphite, Foam formulation offers exceptional resistance to thermal cycling effects. This characteristic significantly extends service life in applications subject to frequent temperature fluctuations.The Adhesive - One Side system provides immediate bond strength without requiring curing time. This instant tack property is particularly beneficial for high-volume production environments.The Copper pigmentation serves as a visual indicator of material grade and properties. This identification system streamlines inventory management and prevents misapplication in complex assemblies.Achieving 6.1W/m-K performance, this solution enables more compact thermal designs. Engineers can specify smaller heat sinks without compromising cooling efficiency, saving valuable space in dense layouts.