57GF3127097C000100

The 57GF3127097C000100 from Laird Technologies EMI represents a significant advancement in Thermal - Pads, Sheets for industrial automation systems. This robust thermal solution is specifically designed to meet the demanding requirements of factory automation equipment and industrial control systems.Developed for Thermal Gasket scenarios, this thermal interface material maintains performance in dusty industrial environments. Its unique composition resists contamination while maintaining excellent thermal transfer characteristics.As a high-reliability Graphite-Pad, Sheet, this product offers exceptional long-term stability under continuous operation. The material maintains its thermal properties even after extended exposure to industrial operating conditions.Precision-engineered in Rectangular formats, this solution enables efficient thermal management of industrial power electronics. The optimized geometries ensure maximum contact area with heat-generating components.Available in 300.00mm x 12.70mm sizes, this material accommodates both large motor drives and compact control modules. The standardized dimensions ensure compatibility with common industrial enclosure designs.The carefully controlled 0.382" (9.70mm) provides optimal balance between thermal transfer and mechanical compliance. This characteristic is particularly valuable in applications subject to mechanical vibration.Formulated with industrial-grade Copper - Graphite, Foam, this pad exhibits exceptional resistance to oils and chemicals. This property ensures reliable performance in harsh manufacturing environments.Featuring Adhesive - One Side properties, this solution offers secure component bonding in vibrating environments. The high-tack formulation maintains adhesion integrity throughout the product lifecycle.The Copper identification system enables quick visual verification during maintenance procedures. This feature simplifies component replacement in complex industrial systems.With an ultra-low 0.10°C/W rating, this material minimizes thermal bottlenecks in critical heat paths. The optimized structure facilitates efficient heat transfer away from sensitive components.Achieving 10.5W/m-K performance, this solution enables more efficient cooling of industrial power electronics. The material's consistent performance helps extend component lifespan in demanding applications.