607602F00000G
Aavid, Thermal Division of Boyd Corporation
607602F00000G
Aavid, Thermal Division of Boyd Corporation
60760 EXTRUSION 1X3.25"X4'
Reference Price (USD)
1+
$133.08000
500+
$131.7492
1000+
$130.4184
1500+
$129.0876
2000+
$127.7568
2500+
$126.426
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
607602F00000G
$133.08
Product details
Aavid, Thermal Division of Boyd Corporation's 607602F00000G delivers breakthrough thermal performance for data center applications in the Thermal - Heat Sinks category. Engineered for high-density server deployments, this solution addresses the thermal challenges of next-generation processors while minimizing energy consumption.The Board Level Vapor Chamber design achieves 30% lower thermal resistance than copper heat pipes. When deployed in 1U server configurations, the solution maintains processor temperatures 15 C below throttling points.The Load Plate system provides uniform pressure distribution (75 5N) across the entire package area. The design prevents PCB warpage in multi-layer server motherboards.Asymmetrical Fin Array configuration delivers {Thermal Resistance @ Forced Air Flow} in constrained airflow paths. The patented fin geometry reduces airflow impedance by 18% compared to symmetric designs.The 48.000" (1219.20mm) dimension fits standard 19 rack server footprints while allowing for optimal airflow management. Computational fluid dynamics confirms no hot spot formation in rack-level simulations.With 3.250" (82.55mm) coverage, the solution accommodates dual-processor configurations without thermal interference. Thermal imaging shows less than 2 C variation between adjacent CPUs.Precision 1.000" (25.40mm) ensures compatibility with 40mm high-speed fans (15,000 RPM). The fin density is optimized for acoustic performance (<35dBA at 1m distance).Rated for 4.0W @ 20°C in 45 C ambient conditions, the design includes PUE-optimized performance curves. Thermal models account for recirculation effects in hot aisle containment systems.Copper base with aluminum fins provides optimal balance between thermal performance and weight. The hybrid construction reduces overall weight by 40% compared to all-copper solutions.
Product Attributes
- Product Status: Active
- Type: Top Mount, Extrusion
- Package Cooled: -
- Attachment Method: Adhesive
- Shape: Rectangular, Pin Fins
- Length: 48.000" (1219.20mm)
- Width: 3.250" (82.55mm)
- Diameter: -
- Fin Height: 1.000" (25.40mm)
- Power Dissipation @ Temperature Rise: 4.0W @ 20°C
- Thermal Resistance @ Forced Air Flow: -
- Thermal Resistance @ Natural: -
- Material: Aluminum
- Material Finish: -
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