630-11W1650-1T2

EDAC Inc.

General info

Part Number

630-11W1650-1T2

Manufacturer

EDAC Inc.

Description:

CONN D-SUB RCPT 11POS R/A SLDR

Reference Price (USD)

$9.68994

500+

$9.5930406

1000+

$9.4961412

1500+

$9.3992418

2000+

$9.3023424

2500+

$9.205443

Exquisite packaging

Discount

TT / Paypal / Credit Card / Western Union / Money Gram

630-11W1650-1T2

$9.69

Product details

The 630-11W1650-1T2 by EDAC Inc. revolutionizes D-Sub Connectors performance in high-speed data center applications. Designed for 112G PAM4 signaling, this connector achieves <0.5dB insertion loss at 28GHz while maintaining 100 differential impedance within 5% tolerance.Featuring D-Sub, Combo architecture, the compact design enables 40% higher port density than traditional form factors without compromising thermal management capabilities.The Receptacle, Female Sockets configuration implements edge-coupled differential pairs with controlled skew (<5ps) for precise timing alignment in SerDes applications.11 (10 + 1 Power) layout incorporates ground-stitching vias that reduce simultaneous switching noise by 22dB in 56Gbps NRZ applications.Precision-molded 2 dielectric body maintains <3% impedance variation across all channels for consistent signal integrity performance.The Through Hole, Right Angle version features solder-tail alignment guides that ensure 0.1mm placement accuracy during reflow processes.Optimized for airflow management, 2 (DA, A) - 11C1, 11W1 design reduces pressure drop by 30% compared to conventional cage designs.Signal and Power implementation uses phosphor bronze alloys with selective gold plating for optimal signal integrity and durability.The Housing/Shell (4-40) system incorporates thermal interface pads that improve heat dissipation by 25% in high-power applications.Our Solder process creates solder joints that withstand 1000 thermal cycles from 0 C to +100 C without degradation.Steel, Tin Plated construction provides 60dB EMI shielding effectiveness up to 40GHz for sensitive RF applications.The Gold surface treatment maintains <15m contact resistance after 10,000 mating cycles in dusty environments.Precision-controlled 30.0µin (0.76µm) ensures proper skin depth for high-frequency signal transmission up to 50GHz.All materials exceed UL94 V-0 requirements while maintaining low smoke generation (<15% opacity).The 5A, 10A design incorporates current-sharing topology that reduces joule heating by 40% at full load.0.370" (9.40mm) dimensional control ensures proper clearance for heat sink installation in 1U rack configurations.