63205-501
Laird Thermal Systems, Inc.
Product details
Laird Thermal Systems, Inc.'s 63205-501 sets new standards for precision cooling in Thermal - Thermoelectric, Peltier Modules applications. Developed for semiconductor test equipment, this Peltier module delivers milli-Kelvin temperature stability and rapid thermal cycling capabilities. Its ultra-clean design prevents contamination in sensitive wafer probing and IC testing environments.<p>The precision-machined Square - 29.72mm L x 29.72mm W surfaces ensure perfect thermal interface with probe card assemblies while maintaining strict flatness tolerances.</p><p>With 21.4W @ 25°C heat pumping capacity, the module maintains exacting temperature control for advanced semiconductor characterization.</p><p>The 68°C @ 25°C maximum temperature differential enables comprehensive device testing across military temperature ranges.</p><p>The 3.99mm vertical dimension has been minimized to reduce thermal mass while maintaining structural integrity in high-cycle test applications.</p><p>Precision current regulation up to 2.5 A enables sub-degree temperature control for sensitive IC characterization.</p><p>The 14.5 V voltage rating accommodates both benchtop and automated test equipment power requirements.</p><p>Ultra-consistent 5.3 Ohms across production units ensures repeatable test conditions for statistical process control.</p><p>Certified for 80°C operation, the module performs reliably in burn-in and accelerated life testing applications.</p><p>The Lead Wires, Non-Sealed design prevents particulate generation and outgassing in cleanroom test environments.</p>
Product Attributes
- Product Status: Active
- Size / Dimension: Square - 29.72mm L x 29.72mm W
- Qmax @ Th: 21.4W @ 25°C
- Delta Tmax @ Th: 68°C @ 25°C
- Height: 3.99mm
- Number of Stages: -
- Current - Max: 2.5 A
- Voltage - Max: 14.5 V
- Resistance: 5.3 Ohms
- Operating Temperature: 80°C
- Features: Lead Wires, Non-Sealed