633-015-663-545
EDAC Inc.
633-015-663-545
EDAC Inc.
633 SERIES RIGHT ANGLE D-SUB PLU
Reference Price (USD)
1+
$5.46840
500+
$5.413716
1000+
$5.359032
1500+
$5.304348
2000+
$5.249664
2500+
$5.19498
Exquisite packaging
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633-015-663-545
$5.47
Product details
The 633-015-663-545 by EDAC Inc. revolutionizes D-Sub Connectors performance in high-speed data center applications. Designed for 112G PAM4 signaling, this connector achieves <0.5dB insertion loss at 28GHz while maintaining 100 differential impedance within 5% tolerance.Featuring D-Sub, High Density architecture, the compact design enables 40% higher port density than traditional form factors without compromising thermal management capabilities.The Plug, Male Pins configuration implements edge-coupled differential pairs with controlled skew (<5ps) for precise timing alignment in SerDes applications.15 layout incorporates ground-stitching vias that reduce simultaneous switching noise by 22dB in 56Gbps NRZ applications.Precision-molded 3 dielectric body maintains <3% impedance variation across all channels for consistent signal integrity performance.The Board Edge, Through Hole, Right Angle version features solder-tail alignment guides that ensure 0.1mm placement accuracy during reflow processes.Optimized for airflow management, 1 (DE, E) High Density design reduces pressure drop by 30% compared to conventional cage designs.Signal implementation uses phosphor bronze alloys with selective gold plating for optimal signal integrity and durability.The Housing/Shell (M3) system incorporates thermal interface pads that improve heat dissipation by 25% in high-power applications.Our Solder process creates solder joints that withstand 1000 thermal cycles from 0 C to +100 C without degradation.Steel, Nickel Plated construction provides 60dB EMI shielding effectiveness up to 40GHz for sensitive RF applications.The Gold surface treatment maintains <15m contact resistance after 10,000 mating cycles in dusty environments.Precision-controlled 30.0µin (0.76µm) ensures proper skin depth for high-frequency signal transmission up to 50GHz.All materials exceed UL94 V-0 requirements while maintaining low smoke generation (<15% opacity).The 3A per Contact design incorporates current-sharing topology that reduces joule heating by 40% at full load.0.350" (8.89mm) dimensional control ensures proper clearance for heat sink installation in 1U rack configurations.Board Lock, Grounding Indents, Mounting Brackets, Shielded include integrated retimer circuitry that compensates for up to 36dB channel loss at 56Gbps.
Product Attributes
- Product Status: Active
- Connector Style: D-Sub, High Density
- Connector Type: Plug, Male Pins
- Number of Positions: 15
- Number of Rows: 3
- Mounting Type: Board Edge, Through Hole, Right Angle
- Shell Size, Connector Layout: 1 (DE, E) High Density
- Contact Type: Signal
- Flange Feature: Housing/Shell (M3)
- Termination: Solder
- Primary Material: -
- Shell Material, Finish: Steel, Nickel Plated
- Contact Finish: Gold
- Contact Finish Thickness: 30.0µin (0.76µm)
- Ingress Protection: -
- Material Flammability Rating: UL94 V-0
- Current Rating (Amps): 3A per Contact
- Backset Spacing: 0.350" (8.89mm)
- Features: Board Lock, Grounding Indents, Mounting Brackets, Shielded
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