63664-2

The 63664-2 by TE Connectivity AMP Connectors redefines excellence in Terminals - Magnetic Wire Connectors, specifically engineered for high-speed data center applications. This innovative component features impedance-matched design that maintains signal integrity up to 56Gbps, making it ideal for next-generation server backplanes. With its advanced dielectric materials, the connector minimizes insertion loss while maximizing bandwidth density.The 300 configuration incorporates blind-mate capabilities that enable tool-less server maintenance. Compared to traditional designs, this style reduces rack installation time by 35% while providing superior EMI containment through its 360 shielding.Featuring Box IDC technology, the contacts utilize multi-finger beam designs that ensure consistent normal force across temperature variations. When subjected to 10,000 mating cycles, these terminals demonstrate less than 2% variation in contact resistance.Precision-engineered to 2 specifications, the compact form factor supports 1U rack configurations while meeting IEEE 802.3bj standards. The micro-pitch variants enable breakthrough port density for top-of-rack switches.Optimized for Quick Connect processes, the connector features solder-tail options compatible with lead-free reflow profiles. This termination method achieves void rates below 5% in automated optical inspection (AOI) tests.Compatible with 23-27 AWG ranges, the connector supports both differential pairs and power delivery networks. The dual-stage strain relief system prevents conductor fatigue in high-vibration server environments.Incorporating QC .187 technology, these connectors provide integrated ESD protection up to 15kV. The color-coded polarization features eliminate misalignment during blind mating operations.