6368168-1
TE Connectivity AMP Connectors
6368168-1
TE Connectivity AMP Connectors
2X1 OFFSET STK MJ,W/GRND C
Reference Price (USD)
1+
$12.22867
500+
$12.1063833
1000+
$11.9840966
1500+
$11.8618099
2000+
$11.7395232
2500+
$11.6172365
Exquisite packaging
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6368168-1
$12.23
Product details
The 6368168-1 by TE Connectivity AMP Connectors is a breakthrough in Modular Connectors - Jacks technology for quantum computing applications. This cryogenic-ready interconnect maintains signal integrity at ultra-low temperatures while minimizing thermal load.The Jack design operates reliably from 4K to 300K. SMPM-compatible versions support 40GHz bandwidth in dilution refrigerator systems.8p8c (RJ45, Ethernet) configuration minimizes thermal conductivity. The 24-contact version exhibits <1 W heat leak per contact at 4K.2 port arrangement enables multi-qubit control systems. The 8-port version reduces wiring complexity in cryostats by 70%.The 2 row design optimizes space in confined cryogenic environments. The staggered row configuration prevents ice bridging.Board Edge; Panel Mount; Through Hole includes ultra-high vacuum flanges. The conflat CF version maintains <10-9 mbar l/s leak rates.90° Angle (Right) options accommodate complex cryostat geometries. The right-angle version minimizes cold head interference.Solder methods include superconducting wire bonds. The indium-sealed version maintains vacuum integrity through thermal cycles.Shielded, EMI Finger effectiveness exceeds 60dB at millikelvin temperatures. The mu-metal enclosure prevents magnetic interference with qubits.Cat5 include MIL-STD-883 for cryogenic reliability. The 50 versions support microwave qubit control lines.Board Guide, Offset Latch include thermal break technology. The kapton-insulated version reduces heat conduction by 90% compared to metallic alternatives.Does Not Contain LED indicators function at cryogenic temperatures. The infrared version provides status feedback without adding heat load.Up and Down mechanism operates reliably in vacuum. The magnetic coupling version eliminates mechanical linkages.Phosphor Bronze maintains ductility at 4K. Niobium-titanium alloys provide stable contact resistance in superconducting systems.Gold plating prevents oxidation in UHV environments. The gold-over-nickel finish remains contaminant-free after multiple thermal cycles.
Product Attributes
- Product Status: Active
- Connector Type: Jack
- Number of Positions/Contacts: 8p8c (RJ45, Ethernet)
- Number of Ports: 2
- Number of Rows: 2
- Mounting Type: Board Edge; Panel Mount; Through Hole
- Orientation: 90° Angle (Right)
- Termination: Solder
- Shielding: Shielded, EMI Finger
- Ratings: Cat5
- Features: Board Guide, Offset Latch
- LED Color: Does Not Contain LED
- Ingress Protection: -
- Tab Direction: Up and Down
- Contact Material: Phosphor Bronze
- Contact Finish: Gold
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