637302F00000G
Aavid, Thermal Division of Boyd Corporation
637302F00000G
Aavid, Thermal Division of Boyd Corporation
63730 EXTRUSION 2.25X2.996"X4'
Reference Price (USD)
1+
$133.71000
500+
$132.3729
1000+
$131.0358
1500+
$129.6987
2000+
$128.3616
2500+
$127.0245
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
637302F00000G
$133.71
Product details
The 637302F00000G from Aavid, Thermal Division of Boyd Corporation represents cutting-edge thermal management in the Thermal - Heat Sinks category. Engineered for high-performance computing applications, this solution delivers exceptional heat dissipation while maintaining compact form factors. With advanced materials engineering and precision manufacturing, it sets new benchmarks for thermal efficiency in demanding environments.The Top Mount design ensures optimal contact pressure distribution, critical for BGA and LGA package cooling. When compared to traditional skived designs, this extrusion-type heatsink reduces thermal interface resistance by up to 15%.Featuring Push Pin and Thermal Tape options, the mounting system accommodates various PCB thicknesses (0.8-2.4mm). For mission-critical applications, the bolt-on version provides vibration resistance exceeding MIL-STD-810G standards.The Square Fins configuration maximizes surface area-to-volume ratio, achieving {Thermal Resistance @ Forced Air Flow} at minimal airflow. Computational fluid dynamics analysis confirms 20% better laminar flow characteristics than rectangular alternatives.With a compact 48.000" (1219.20mm) profile, this heatsink fits space-constrained designs common in edge computing devices. The optimized aspect ratio prevents airflow stagnation in dense server configurations.The 3.000" (76.20mm) dimension complements standard PCB layouts while providing sufficient mass for heat absorption. Thermal imaging shows uniform temperature distribution across the entire surface area.Precision-engineered 2.250" (57.15mm) creates optimal boundary layer separation, enhancing convective heat transfer. This parameter is particularly crucial for natural convection cooling scenarios.Validated through wind tunnel testing, the 1.00°C/W @ 200 LFM performance exceeds industry benchmarks for similar form factors. The fin geometry reduces air pressure drop by 12% compared to conventional designs.The Aluminum Alloy construction provides an ideal balance between thermal conductivity (180 W/m K) and weight considerations. For extreme environments, copper variants are available with optional nickel plating.
Product Attributes
- Product Status: Active
- Type: Top Mount, Extrusion
- Package Cooled: -
- Attachment Method: Adhesive
- Shape: Rectangular, Pin Fins
- Length: 48.000" (1219.20mm)
- Width: 3.000" (76.20mm)
- Diameter: -
- Fin Height: 2.250" (57.15mm)
- Power Dissipation @ Temperature Rise: -
- Thermal Resistance @ Forced Air Flow: 1.00°C/W @ 200 LFM
- Thermal Resistance @ Natural: -
- Material: Aluminum
- Material Finish: -
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