638-M62-630-BT4
EDAC Inc.
638-M62-630-BT4
EDAC Inc.
638M SERIES VERTICAL D-SUB RECEP
Reference Price (USD)
1+
$22.68000
500+
$22.4532
1000+
$22.2264
1500+
$21.9996
2000+
$21.7728
2500+
$21.546
Exquisite packaging
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638-M62-630-BT4
$22.68
Product details
The 638-M62-630-BT4 by EDAC Inc. revolutionizes D-Sub Connectors performance in high-speed data center applications. Designed for 112G PAM4 signaling, this connector achieves <0.5dB insertion loss at 28GHz while maintaining 100 differential impedance within 5% tolerance.Featuring D-Sub, High Density architecture, the compact design enables 40% higher port density than traditional form factors without compromising thermal management capabilities.The Receptacle, Female Sockets configuration implements edge-coupled differential pairs with controlled skew (<5ps) for precise timing alignment in SerDes applications.62 layout incorporates ground-stitching vias that reduce simultaneous switching noise by 22dB in 56Gbps NRZ applications.Precision-molded 3 dielectric body maintains <3% impedance variation across all channels for consistent signal integrity performance.The Through Hole version features solder-tail alignment guides that ensure 0.1mm placement accuracy during reflow processes.Optimized for airflow management, 4 (DC, C) High Density design reduces pressure drop by 30% compared to conventional cage designs.Signal implementation uses phosphor bronze alloys with selective gold plating for optimal signal integrity and durability.The Board Side (4-40); Mating Side (4-40) system incorporates thermal interface pads that improve heat dissipation by 25% in high-power applications.Our Solder process creates solder joints that withstand 1000 thermal cycles from 0 C to +100 C without degradation.Steel, Tin Plated construction provides 60dB EMI shielding effectiveness up to 40GHz for sensitive RF applications.The Gold surface treatment maintains <15m contact resistance after 10,000 mating cycles in dusty environments.Precision-controlled 30.0µin (0.76µm) ensures proper skin depth for high-frequency signal transmission up to 50GHz.All materials exceed UL94 V-0 requirements while maintaining low smoke generation (<15% opacity).The 5A design incorporates current-sharing topology that reduces joule heating by 40% at full load.Shielded include integrated retimer circuitry that compensates for up to 36dB channel loss at 56Gbps.
Product Attributes
- Product Status: Active
- Connector Style: D-Sub, High Density
- Connector Type: Receptacle, Female Sockets
- Number of Positions: 62
- Number of Rows: 3
- Mounting Type: Through Hole
- Shell Size, Connector Layout: 4 (DC, C) High Density
- Contact Type: Signal
- Flange Feature: Board Side (4-40); Mating Side (4-40)
- Termination: Solder
- Primary Material: -
- Shell Material, Finish: Steel, Tin Plated
- Contact Finish: Gold
- Contact Finish Thickness: 30.0µin (0.76µm)
- Ingress Protection: -
- Material Flammability Rating: UL94 V-0
- Current Rating (Amps): 5A
- Backset Spacing: -
- Features: Shielded
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