66259-4
TE Connectivity Aerospace, Defense and Marine
66259-4
TE Connectivity Aerospace, Defense and Marine
CONN PIN 10AWG SILVER CRIMP
Reference Price (USD)
1+
$7.68000
500+
$7.6032
1000+
$7.5264
1500+
$7.4496
2000+
$7.3728
2500+
$7.296
Exquisite packaging
Discount
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Product details
TE Connectivity Aerospace, Defense and Marine's 66259-4 sets new standards in Contacts - Multi Purpose for 5G infrastructure applications. This high-performance interconnect solution combines innovative materials science with precision manufacturing to deliver exceptional RF characteristics.The Power, Stamped architecture incorporates quad-shielded isolation, reducing crosstalk by 40dB compared to conventional designs in millimeter-wave applications.Precision-machined Pin interfaces maintain impedance control within 1 , critical for maintaining signal integrity in high-speed data transmission.Engineered with Crimp technology, the contacts demonstrate 25% lower insertion force while maintaining IEC 60512-100-12 compliant retention force.Supporting 10 AWG wiring configurations, the design facilitates both power delivery and high-frequency signal routing in compact base station equipment.Copper selection provides optimal spring characteristics for maintaining contact force over extended thermal cycling (-55 C to +125 C).The Silver surface treatment achieves <5m contact resistance, meeting stringent requirements for low-voltage power distribution systems.Precision-controlled 100.0µin (2.54µm) deposition ensures consistent RF performance across production batches for phased array antenna applications.
Product Attributes
- Product Status: Active
- Type: Power, Stamped
- Pin or Socket: Pin
- Contact Termination: Crimp
- Wire Gauge: 10 AWG
- Contact Material: Copper
- Contact Finish: Silver
- Contact Finish Thickness: 100.0µin (2.54µm)