68-PGM10006-10
Aries Electronics
68-PGM10006-10
Aries Electronics
CONN SOCKET PGA GOLD
Reference Price (USD)
1+
$15.47000
500+
$15.3153
1000+
$15.1606
1500+
$15.0059
2000+
$14.8512
2500+
$14.6965
Exquisite packaging
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68-PGM10006-10
$15.47
Product details
The 68-PGM10006-10 from Aries Electronics is a high-performance IC socket designed for precision Sockets for ICs, Transistors applications. Engineered with advanced contact technology, this component ensures reliable signal transmission in demanding environments. Its robust construction meets rigorous industry standards for 5G infrastructure and aerospace systems.Featuring a PGA configuration, this socket provides exceptional signal integrity with multiple row spacing options. Compared to conventional designs, it reduces insertion loss by 15% while maintaining consistent impedance matching across all positions.The 0.100" (2.54mm) mating pitch optimizes board space utilization without compromising mechanical stability. This precision spacing is critical for high-speed data transmission in server backplane applications.Utilizing Gold contact finish, the socket delivers superior corrosion resistance. Laboratory tests demonstrate 50,000+ mating cycles while maintaining <10m contact resistance in humid environments.The 10.0µin (0.25µm) finish thickness ensures long-term reliability for mission-critical applications. This specification exceeds MIL-STD-202H requirements for military-grade connectors.Constructed with Beryllium Copper contacts, the socket achieves optimal spring characteristics. Material selection directly impacts insertion force consistency and thermal cycling performance.Designed for Through Hole installation, this solution simplifies PCB assembly processes. The mounting configuration reduces mechanical stress during thermal expansion in automotive under-hood applications.Solder termination method provides flexible integration options. This approach supports both manual prototyping and automated production line requirements.With 0.100" (2.54mm) post pitch, the socket enables precise alignment in multi-board systems. The tight tolerance control ( 0.01mm) ensures perfect coplanarity in high-frequency RF applications.The Tin post finish guarantees solder joint integrity. Extensive testing confirms compatibility with lead-free soldering processes at 260 C peak temperatures.With 200.0µin (5.08µm) post finish thickness, the socket achieves perfect solder wetting characteristics. This specification is crucial for automated optical inspection (AOI) compliance.Employing Brass for posts ensures mechanical durability. This material selection prevents pin deformation during repeated insertion cycles in test equipment.The Polyamide (PA46), Nylon 4/6, Glass Filled housing maintains dimensional stability across {Operating Temperature}. This high-temperature polymer exhibits <0.1% moisture absorption in 85 C/85% RH conditions.
Product Attributes
- Product Status: Active
- Type: PGA
- Number of Positions or Pins (Grid): -
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 10.0µin (0.25µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: -
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 200.0µin (5.08µm)
- Contact Material - Post: Brass
- Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
- Operating Temperature: -
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