695-1B
Wakefield-Vette
695-1B
Wakefield-Vette
HEATSINK FOR STUD MT DIODE BLACK
Reference Price (USD)
1+
$1.28000
500+
$1.2672
1000+
$1.2544
1500+
$1.2416
2000+
$1.2288
2500+
$1.216
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
695-1B
$1.28
Product details
The 695-1B from Wakefield-Vette sets new benchmarks for thermal management in Thermal - Heat Sinks for consumer electronics. Designed for slim-profile devices, this solution delivers exceptional cooling performance while meeting stringent aesthetic and acoustic requirements.The Ultra-Thin Vapor Chamber design achieves just {Length} profile height while maintaining 25W/cm heat flux capacity. Compared to traditional heat spreaders, this solution reduces junction temperatures by up to 12 C.Optimized for mobile SoCs and GPU packages, the solution handles {Power Dissipation @ Temperature Rise} in 35 C ambient conditions. The thermal interface maintains performance through 1000+ power cycles.The Pressure-Sensitive Adhesive system allows for tool-less installation with consistent bond strength (3-5N/cm ). The adhesive maintains performance across -20 C to +85 C operating range.For cylindrical battery cells, the 0.625" (15.88mm) ID, 1.330" (33.78mm) OD variant provides 180 cooling coverage. The design maintains thermal contact during typical device flexing (up to 5 bend angle).Precision 0.530" (13.46mm) of just 0.5mm enables integration in sub-8mm device profiles. The nanostructured surface enhances heat transfer coefficient by 15%.Rated for 4.0W @ 72°C in portable device environments, the design includes skin temperature limits for user comfort. Thermal models account for pocket-use scenarios.The 5.20°C/W @ 400 LFM performance is optimized for low-speed fans (<5 CFM). The design maintains acoustic levels below 25dBA in typical usage scenarios.The 18.00°C/W specification enables passive cooling in standby modes. The design maintains surface temperatures below 45 C in still air conditions.High-conductivity graphite laminate provides exceptional in-plane thermal conductivity (800 W/m K). The material is 40% lighter than equivalent aluminum solutions.Black PVD coating ensures aesthetic consistency with consumer electronics while improving radiative cooling. The finish meets MIL-STD-810G abrasion resistance requirements.
Product Attributes
- Product Status: Obsolete
- Type: Board Level
- Package Cooled: Stud Mounted Diode
- Attachment Method: Bolt On
- Shape: -
- Length: -
- Width: -
- Diameter: 0.625" (15.88mm) ID, 1.330" (33.78mm) OD
- Fin Height: 0.530" (13.46mm)
- Power Dissipation @ Temperature Rise: 4.0W @ 72°C
- Thermal Resistance @ Forced Air Flow: 5.20°C/W @ 400 LFM
- Thermal Resistance @ Natural: 18.00°C/W
- Material: Aluminum
- Material Finish: Black Anodized
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