7-1542004-3
TE Connectivity AMP Connectors
7-1542004-3
TE Connectivity AMP Connectors
HEAT SINK BGA 21MM 3FIN RADIAL
Reference Price (USD)
1+
$7.88000
500+
$7.8012
1000+
$7.7224
1500+
$7.6436
2000+
$7.5648
2500+
$7.486
Exquisite packaging
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Product details
TE Connectivity AMP Connectors's 7-1542004-3 offers military-grade thermal solutions in the Thermal - Heat Sinks segment, specifically developed for aerospace and defense applications. This ruggedized design exceeds stringent military specifications while delivering exceptional thermal performance in extreme environments.Engineered for power modules in radar and avionics systems, the solution manages {Power Dissipation @ Temperature Rise} at 50,000ft altitude. The thermal interface maintains performance across -55 C to +125 C operational range.The Solderable Feet attachment meets IPC-CC-830 requirements for high-reliability soldering. The design survives 1000+ thermal cycles from -55 C to +125 C without joint degradation.Angled Fins configuration delivers {Thermal Resistance @ Forced Air Flow} in reverse airflow conditions common in aircraft. The aerodynamic profile reduces pressure drop by 18% compared to straight fins.For cylindrical radar components, the 1.375" (34.92mm) OD variant offers hermetic sealing compatibility. The design withstands rapid decompression from sea level to 50,000ft in <5 seconds.Optimized 0.442" (11.23mm) ensures performance in thin-atmosphere conditions. The fin geometry is validated through computational fluid dynamics at 0.2atm pressure.The 6.00°C/W @ 200 LFM is qualified under MIL-STD-810G sand/dust conditions. The design prevents performance degradation despite particulate exposure.The 13.20°C/W specification enables operation during cooling system failures. The design maintains critical components below 100 C in zero-airflow conditions for 60 minutes.AavSHIELD 3C coated Aluminum provides EMI/RFI shielding exceeding MIL-STD-461G requirements. The material maintains thermal performance after salt fog exposure per MIL-STD-810G.Tin-plated finish ensures solderability after long-term storage per MIL-STD-2073-1. The surface treatment provides corrosion protection in naval environments.
Product Attributes
- Product Status: Active
- Type: -
- Package Cooled: BGA
- Attachment Method: Clip
- Shape: Cylindrical
- Length: -
- Width: -
- Diameter: 1.375" (34.92mm) OD
- Fin Height: 0.442" (11.23mm)
- Power Dissipation @ Temperature Rise: -
- Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 200 LFM
- Thermal Resistance @ Natural: 13.20°C/W
- Material: Aluminum
- Material Finish: Black Anodized