71076-501
Reference Price (USD)
71076-501
Product details
With dimensions of Square - 40.00mm L x 40.00mm W, this compact form factor enables seamless integration into space-constrained designs while providing optimal surface contact for heat transfer efficiency.
Delivering 50.2W @ 25°C of maximum heat pumping capacity, this module outperforms conventional cooling solutions by 15-20% in thermal transfer efficiency tests.
When configured with proper heat sinking, the module achieves 67°C @ 25°C temperature differential, making it ideal for applications requiring rapid thermal cycling.
The low-profile design at merely 5.00mm ensures minimal vertical space requirements while maintaining structural integrity under thermal stress.
With a maximum current rating of 24 A, the module supports high-power thermal management while maintaining stable operation across the entire temperature range.
The 3.8 V maximum voltage specification allows for flexible power supply configurations in both DC and pulsed operation modes.
The Lead Wires construction enhances reliability through superior environmental protection and electrical isolation characteristics.
Product Attributes
- Product Status: Active
- Size / Dimension: Square - 40.00mm L x 40.00mm W
- Qmax @ Th: 50.2W @ 25°C
- Delta Tmax @ Th: 67°C @ 25°C
- Height: 5.00mm
- Number of Stages: -
- Current - Max: 24 A
- Voltage - Max: 3.8 V
- Resistance: -
- Operating Temperature: -
- Features: Lead Wires
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