73944-0000
Molex
Product details
Molex's 73944-0000 redefines Backplane Connectors - Specialized technology for aerospace satellite payload systems. This space-grade connector solution combines radiation-hardened materials with ultra-high-frequency performance for next-generation communications satellites.The Header, Male Pins interface configuration meets MIL-DTL-38999 Series III requirements while supporting Ka-band signal transmission.Featuring HDM Guide B technology, this series provides reliable RF performance in vacuum and thermal cycling environments.With 72 contact positions, the connector enables comprehensive payload subsystem integration in smallsat constellations.The All loaded configuration offers mass-optimized solutions for deployable satellite mechanisms.The 0.079" (2.00mm) spacing configuration maintains impedance control for high-speed digital interfaces in satellite processors.6 row design enables efficient packaging for modular satellite bus architectures.The 12 column arrangement supports high-speed data buses in Earth observation payloads.The Through Hole mounting system ensures mechanical stability during launch vehicle vibration profiles.The Solder method has been qualified for wire-wrap reliability in zero-gravity conditions.Gold plating technology exceeds ESA ECSS-Q-ST-70-08C requirements for space connector reliability.29.5µin (0.75µm) coating thickness ensures long-term performance in atomic oxygen environments.The Black housing material provides thermal emissivity properties optimized for spacecraft thermal management.
Product Attributes
- Product Status: Active
- Connector Usage: -
- Connector Type: Header, Male Pins
- Connector Style: HDM Guide B
- Number of Positions: 72
- Number of Positions Loaded: All
- Pitch: 0.079" (2.00mm)
- Number of Rows: 6
- Number of Columns: 12
- Mounting Type: Through Hole
- Termination: Solder
- Contact Layout, Typical: -
- Features: -
- Contact Finish: Gold
- Contact Finish Thickness: 29.5µin (0.75µm)
- Color: Black