745287-8
TE Connectivity AMP Connectors
745287-8
TE Connectivity AMP Connectors
CONN PIN GOLD SOLDER CUP
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Product details
TE Connectivity AMP Connectors's 745287-8 sets new standards in Contacts - Multi Purpose for 5G infrastructure applications. This high-performance interconnect solution combines innovative materials science with precision manufacturing to deliver exceptional RF characteristics.The Stamped architecture incorporates quad-shielded isolation, reducing crosstalk by 40dB compared to conventional designs in millimeter-wave applications.Precision-machined Pin interfaces maintain impedance control within 1 , critical for maintaining signal integrity in high-speed data transmission.Engineered with Solder Cup technology, the contacts demonstrate 25% lower insertion force while maintaining IEC 60512-100-12 compliant retention force.Brass selection provides optimal spring characteristics for maintaining contact force over extended thermal cycling (-55 C to +125 C).The Gold surface treatment achieves <5m contact resistance, meeting stringent requirements for low-voltage power distribution systems.Precision-controlled 30.0µin (0.76µm) deposition ensures consistent RF performance across production batches for phased array antenna applications.
Product Attributes
- Product Status: Obsolete
- Type: Stamped
- Pin or Socket: Pin
- Contact Termination: Solder Cup
- Wire Gauge: -
- Contact Material: Brass
- Contact Finish: Gold
- Contact Finish Thickness: 30.0µin (0.76µm)
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