780652F00000G
Aavid, Thermal Division of Boyd Corporation
        
                                780652F00000G                            
                        
                                Aavid, Thermal Division of Boyd Corporation                            
                        
                                78065 EXTRUSION 1.1X0.76"X4.1'                            
                        Reference Price (USD)
1+
                                            $128.58000
                                        500+
                                            $127.2942
                                        1000+
                                            $126.0084
                                        1500+
                                            $124.7226
                                        2000+
                                            $123.4368
                                        2500+
                                            $122.151
                                        Exquisite packaging
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                            Product details
                    The 780652F00000G from Aavid, Thermal Division of Boyd Corporation delivers precision thermal management for medical devices in the Thermal - Heat Sinks category. Designed for reliability in life-critical applications, this solution combines biocompatible materials with exceptional thermal performance for imaging and diagnostic equipment.The Board Level Extrusion design provides EMI shielding compatibility crucial for sensitive medical electronics. The integrated grounding features reduce RF interference by 25dB compared to standard designs.Rectangular Fins configuration achieves {Thermal Resistance @ Forced Air Flow} in laminar airflow environments. The streamlined design prevents particulate accumulation per ISO 14644 Class 5 cleanroom standards.The 49.500" (1257.30mm) dimension fits standard medical cart footprints while providing sufficient thermal mass for pulsed power loads. The design minimizes eddy currents in MRI environments.With 0.764" (19.40mm) coverage, the solution cools multi-channel sensor arrays without thermal crosstalk. Infrared thermography shows less than 1 C variation across critical components.Precision 0.846" (21.50mm) ensures compatibility with medical device airflow restrictions (typically <0.5m/s). The fin density is optimized for silent operation (<20dB) in patient care environments.The 3.80°C/W @ 200 LFM performance is validated under the intermittent operation profiles typical of medical equipment. The design maintains stable performance during 10% duty cycle bursts.Medical-grade Aluminum (EN AW-1350) with 99.5% purity ensures biocompatibility. The material is certified per ISO 10993-5 for cytotoxicity and ISO 10993-10 for irritation sensitivity.                
                Product Attributes
- Product Status: Active
- Type: Top Mount, Extrusion
- Package Cooled: -
- Attachment Method: -
- Shape: Rectangular, Pin Fins
- Length: 49.500" (1257.30mm)
- Width: 0.764" (19.40mm)
- Diameter: -
- Fin Height: 0.846" (21.50mm)
- Power Dissipation @ Temperature Rise: -
- Thermal Resistance @ Forced Air Flow: 3.80°C/W @ 200 LFM
- Thermal Resistance @ Natural: -
- Material: Aluminum
- Material Finish: -


 
                         
                                     
                                     
                                     
                                     
                                     
                                     
                                     
                                     
                                    