8-165049-2

Optimized for next-generation AI server clusters, TE Connectivity AMP Connectors's 8-165049-2 delivers breakthrough performance in Terminals - Wire Pin Connectors. These impedance-controlled connectors support 112G PAM4 signaling with <35ps skew across 400G QSFP-DD interfaces. The patented crosstalk cancellation technology reduces NEXT by 18dB compared to standard designs.The Circular - 0.102" (2.60mm) Dia specifications maintain 85 differential impedance for PCIe Gen5 backplane connections. The elliptical contact shape reduces insertion loss by 15% at 16GHz frequencies.Precision-machined 0.394" (10.00mm) pins ensure uniform stub lengths in DDR5 memory module sockets. The controlled impedance profile minimizes reflections in 56Gbps NRZ channels.With 1.146" (29.11mm) dimensions, these connectors enable 1U server configurations with 32x NVMe drive backplanes. The low-profile design improves airflow dynamics in hyperscale data centers.Supporting 10-12 AWG (2.7~6.6mm²) cabling, these terminals feature eye-of-the-needle contacts that maintain <1m resistance after 5,000 insertion cycles in GPU cluster interconnects.The 0.150" ~ 0.248" (3.81mm ~ 6.30mm) range includes ultra-low-loss materials with Dk=2.4 0.05 up to 40GHz. The foam dielectric variants reduce weight by 30% in airborne server applications.Insulated options incorporate conductive fillers that provide 60dB EMI shielding effectiveness, critical for preventing signal integrity issues in 5G edge computing nodes.The Crimp methodology uses laser-welded contacts that survive 2000 thermal cycles from -55 C to +125 C, meeting Open19 infrastructure requirements.Innovative Serrated Termination include integrated thermal sensors that enable dynamic cooling control in liquid-immersed server applications, reducing PUE to <1.05.Yellow coding follows OCP standards for rapid identification of 48V power distribution rails in modular data center architectures.