8-53222-3

Engineered for next-generation computing infrastructure, TE Connectivity AMP Connectors's 8-53222-3 delivers breakthrough performance in Terminals - Wire Splice Connectors technology. This high-speed interconnect solution enables 400G Ethernet and AI accelerator applications with unprecedented signal integrity.The 3 Way Splice architecture implements differential pair routing that maintains 100 impedance tolerance. When deployed in server backplanes, it demonstrates <0.5ps skew across 56G PAM4 channels.Featuring 3 pathways, this connector supports orthogonal direct-connect architectures. Benchmark tests show 40% reduction in crosstalk compared to traditional mezzanine designs.Utilizing Crimp technology, the connector achieves <0.2dB/inch insertion loss at 28GHz. The patented via design minimizes stub reflections in multilayer PCB applications.Optimized for 14-16 AWG controlled impedance cables, this solution enables 112G SerDes implementations. The precision alignment features ensure <5 m positional tolerance during blind mating.The Partial Insulation system employs low-Dk materials with 0.02 dissipation factor at 10GHz. This ultra-pure dielectric maintains eye diagram integrity in long-reach copper interconnects.Designed with Serrated Mating Area, this connector series supports 25.6Tbps aggregate bandwidth. The integrated heat sink design maintains temperatures below 85 C at full operational load.Blue identifiers follow Open Compute Project standards for hyperscale data centers. The laser-etched markings withstand repeated cleaning cycles in server hot aisles.