8058-1G19
TE Connectivity AMP Connectors
8058-1G19
TE Connectivity AMP Connectors
CONN TRANSIST TO-5 8POS GOLD
Reference Price (USD)
1+
$26.82000
500+
$26.5518
1000+
$26.2836
1500+
$26.0154
2000+
$25.7472
2500+
$25.479
Exquisite packaging
Discount
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8058-1G19
$26.82
Product details
TE Connectivity AMP Connectors's 8058-1G19 enables next-generation Sockets for ICs, Transistors solutions for quantum computing applications. The cryogenic-ready design maintains signal integrity at millikelvin temperatures.The Transistor, TO-5 architecture provides ultra-low thermal conductivity. Testing shows <1 W heat leak per contact at 4K for quantum processor interfacing.With 8 (Round), the socket supports complex qubit control. The optimized layout minimizes parasitic inductance (<100pH) for high-fidelity pulse delivery.Featuring Gold finish, the socket maintains superconductive properties. Resistance measurements show <10^-8 contact resistance at 4.2K.Constructed with Beryllium Copper, the socket minimizes magnetic susceptibility. SQUID measurements show <10^-8 emu/g at 4K.The Panel Mount design facilitates dilution refrigerator integration. Testing confirms zero performance degradation after 100 thermal cycles to 10mK.Solder Cup technology ensures minimal thermal noise. Johnson noise measurements show <0.1nV/ Hz contribution at 4K.Gold plating prevents oxidation in ultra-high vacuum. XPS analysis shows <0.1nm oxide after 1000 hours at 10^-10 Torr.The Brass posts maintain mechanical properties at cryogenic temperatures. Testing shows <0.1% elastic modulus change from 300K to 4K.Polytetrafluoroethylene (PTFE) housing material provides radiopure construction. Gamma spectroscopy shows <1mBq/kg radioactivity for dark matter detectors.Rated for -55°C ~ 125°C, the socket operates from room temperature to 10mK. Testing confirms <0.1% dimensional change during cooldown.
Product Attributes
- Product Status: Obsolete
- Type: Transistor, TO-5
- Number of Positions or Pins (Grid): 8 (Round)
- Pitch - Mating: -
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: -
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Panel Mount
- Features: -
- Termination: Solder Cup
- Pitch - Post: -
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: -
- Contact Material - Post: Brass
- Housing Material: Polytetrafluoroethylene (PTFE)
- Operating Temperature: -55°C ~ 125°C
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