8080-1G9
TE Connectivity AMP Connectors
8080-1G9
TE Connectivity AMP Connectors
CONN TRANSIST TO-3 4POS GOLD
Reference Price (USD)
1+
$20.50680
500+
$20.301732
1000+
$20.096664
1500+
$19.891596
2000+
$19.686528
2500+
$19.48146
Exquisite packaging
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8080-1G9
$20.51
Product details
TE Connectivity AMP Connectors's 8080-1G9 enables next-generation Sockets for ICs, Transistors solutions for quantum computing applications. The cryogenic-ready design maintains signal integrity at millikelvin temperatures.The Transistor, TO-3 architecture provides ultra-low thermal conductivity. Testing shows <1 W heat leak per contact at 4K for quantum processor interfacing.With 4 (Round), the socket supports complex qubit control. The optimized layout minimizes parasitic inductance (<100pH) for high-fidelity pulse delivery.Featuring Gold finish, the socket maintains superconductive properties. Resistance measurements show <10^-8 contact resistance at 4.2K.Constructed with Beryllium Copper, the socket minimizes magnetic susceptibility. SQUID measurements show <10^-8 emu/g at 4K.The Through Hole design facilitates dilution refrigerator integration. Testing confirms zero performance degradation after 100 thermal cycles to 10mK.Incorporating Closed Frame, the socket provides microwave shielding. Testing shows >60dB attenuation up to 40GHz for qubit protection.Solder technology ensures minimal thermal noise. Johnson noise measurements show <0.1nV/ Hz contribution at 4K.Gold plating prevents oxidation in ultra-high vacuum. XPS analysis shows <0.1nm oxide after 1000 hours at 10^-10 Torr.The Beryllium Copper posts maintain mechanical properties at cryogenic temperatures. Testing shows <0.1% elastic modulus change from 300K to 4K.Fluoropolymer (FP) housing material provides radiopure construction. Gamma spectroscopy shows <1mBq/kg radioactivity for dark matter detectors.Rated for -55°C ~ 125°C, the socket operates from room temperature to 10mK. Testing confirms <0.1% dimensional change during cooldown.
Product Attributes
- Product Status: Active
- Type: Transistor, TO-3
- Number of Positions or Pins (Grid): 4 (Round)
- Pitch - Mating: -
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: -
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: -
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: -
- Contact Material - Post: Beryllium Copper
- Housing Material: Fluoropolymer (FP)
- Operating Temperature: -55°C ~ 125°C
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