8114LB603 REV J
Aavid, Thermal Division of Boyd Corporation
8114LB603 REV J
Aavid, Thermal Division of Boyd Corporation
CONN TRANSIST TO-3 4POS TIN
Reference Price (USD)
1+
$4.05818
500+
$4.0175982
1000+
$3.9770164
1500+
$3.9364346
2000+
$3.8958528
2500+
$3.855271
Exquisite packaging
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8114LB603 REV J
$4.06
Product details
The 8114LB603 REV J from Aavid, Thermal Division of Boyd Corporation delivers laboratory-grade precision for Sockets for ICs, Transistors applications in test and measurement equipment. The ultra-stable design ensures <0.1% measurement uncertainty over 10,000 mating cycles.Featuring Transistor, TO-3 configuration, the socket provides 10^14 insulation resistance. Guarded measurements confirm <1pA leakage current at 1000V for sensitive instrumentation.With 4 (Oval), the socket supports high-precision metrology. The symmetrical layout minimizes thermocouple effects to <0.1 V/ C.The Tin finish provides stable thermoelectric properties. Testing confirms <0.5 V contact potential variation over temperature.Constructed with Brass, the socket minimizes magnetic interference. Testing shows <0.1 T field distortion at 1mm distance.The Through Hole design prevents microphonic noise. Testing confirms <1 V vibration-induced noise in sensitive amplifier circuits.Incorporating Closed Frame, the socket provides Faraday cage shielding. Testing shows >100dB RF isolation up to 10GHz for precision measurements.Solder technology ensures negligible insertion loss. Network analyzer measurements show <0.01dB loss at 6GHz for RF test applications.Tin plating prevents surface oxidation. XPS analysis shows <1nm oxide growth after 1000 hours in cleanroom environments.The Brass posts maintain dimensional stability. Interferometer measurements show <10nm flatness variation over temperature.Phenolic housing material provides ultra-low outgassing. RGA testing shows <1 10^-9 Torr total mass loss for vacuum applications.
Product Attributes
- Product Status: Active
- Type: Transistor, TO-3
- Number of Positions or Pins (Grid): 4 (Oval)
- Pitch - Mating: -
- Contact Finish - Mating: Tin
- Contact Finish Thickness - Mating: -
- Contact Material - Mating: Brass
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: -
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: -
- Contact Material - Post: Brass
- Housing Material: Phenolic
- Operating Temperature: -
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