821-22-032-10-002101
Mill-Max Manufacturing Corp.
821-22-032-10-002101
Mill-Max Manufacturing Corp.
CONN SPRING PISTON 32POS PCB
Reference Price (USD)
1+
$16.51000
500+
$16.3449
1000+
$16.1798
1500+
$16.0147
2000+
$15.8496
2500+
$15.6845
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
821-22-032-10-002101
$16.51
Product details
The 821-22-032-10-002101 by Mill-Max Manufacturing Corp. establishes new benchmarks in Rectangular Connectors - Spring Loaded technology, specifically engineered for aerospace-grade signal transmission systems. Its advanced architecture ensures flawless performance in extreme environmental conditions.Employing Piston topology, this solution provides military-grade EMI shielding effectiveness, critical for avionics systems and satellite communication payloads.Precision-aligned 32 contacts maintain impedance control for high-speed differential pairs in radar signal processing units.The 0.100" (2.54mm) micro-pitch configuration enables ultra-high-density packaging while preserving signal integrity up to 40GHz for phased array antenna systems.With 1 rows arranged in staggered formation, this design minimizes crosstalk in multi-channel data acquisition systems.The Through Hole interface incorporates hermetic sealing technology for operation in vacuum environments and high-altitude applications.Aerospace-certified Copper Alloy alloy maintains dimensional stability across -65 C to +200 C thermal cycles in space vehicle applications.Proprietary Gold plating prevents cold welding in zero-gravity conditions while ensuring reliable mating cycles.The 20.0µin (0.51µm) gold overlay is optimized for RF signal transmission with minimal insertion loss in microwave systems.
Product Attributes
- Product Status: Active
- Connector Type: Piston
- Number of Contacts: 32
- Pitch: 0.100" (2.54mm)
- Number of Rows: 1
- Row Spacing: -
- Mounting Type: Through Hole
- Material: Copper Alloy
- Contact Finish: Gold
- Contact Finish Thickness: 20.0µin (0.51µm)
You May Also Be Interested In
