826-22-058-00-001000
Mill-Max Manufacturing Corp.
826-22-058-00-001000
Mill-Max Manufacturing Corp.
CONN SPRING PISTON 58POS SLD PCB
Reference Price (USD)
1+
$44.15000
500+
$43.7085
1000+
$43.267
1500+
$42.8255
2000+
$42.384
2500+
$41.9425
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
826-22-058-00-001000
$44.15
Product details
The 826-22-058-00-001000 from Mill-Max Manufacturing Corp. represents a breakthrough in Rectangular Connectors - Spring Loaded technology for high-performance computing infrastructure, offering unparalleled signal integrity for data center applications.Utilizing Piston architecture, this solution provides 100 impedance matching for 112G PAM4 signaling in next-generation server backplanes.The 58 contact array supports PCIe Gen5 and CXL protocols with minimal insertion loss for AI accelerator modules.Precision 0.100" (2.54mm) pitch configuration enables 56Gbps NRZ signaling while maintaining crosstalk below -40dB in switch fabric applications.With 2 rows of shielded differential pairs, this design minimizes simultaneous switching noise in GPU clusters.0.100" (2.54mm) spacing configuration includes integrated ground planes for impedance control in high-speed memory interfaces.The Through Hole, Solder Cup interface incorporates thermal management features for high-power CPU sockets in hyperscale data centers.Low-loss Beryllium Copper dielectric maintains signal integrity up to 50GHz for optical transceiver interconnects.Advanced Gold plating technology reduces skin effect losses at millimeter-wave frequencies.The 20.0µin (0.51µm) gold layer is optimized for both DC resistance and high-frequency performance in server applications.
Product Attributes
- Product Status: Active
- Connector Type: Piston
- Number of Contacts: 58
- Pitch: 0.100" (2.54mm)
- Number of Rows: 2
- Row Spacing: 0.100" (2.54mm)
- Mounting Type: Through Hole, Solder Cup
- Material: Beryllium Copper
- Contact Finish: Gold
- Contact Finish Thickness: 20.0µin (0.51µm)
You May Also Be Interested In
