830-10-029-10-005000
Mill-Max Manufacturing Corp.
830-10-029-10-005000
Mill-Max Manufacturing Corp.
STANDARD PIN HEADER
Reference Price (USD)
1+
$17.56280
500+
$17.387172
1000+
$17.211544
1500+
$17.035916
2000+
$16.860288
2500+
$16.68466
Exquisite packaging
Discount
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830-10-029-10-005000
$17.56
Product details
Mill-Max Manufacturing Corp.'s 830-10-029-10-005000 represents the gold standard in Rectangular Connectors - Headers, Specialty Pin technology, optimized for next-generation 5G infrastructure. This advanced interconnect solution combines millimeter-wave performance with ruggedized construction for outdoor base station deployments.The Header architecture supports 25Gbps data rates when implemented with matched impedance PCB layouts.Utilizing Solder Cup contact geometry, the design minimizes skin effect losses at microwave frequencies up to 40GHz.Scalable from 29 positions, the connector family addresses diverse MIMO antenna array configurations.Precision 0.079" (2.00mm) alignment enables error-free blind mating in rack-mounted RF equipment installations.Dual-row (1 rows) configuration reduces connector footprint by 40% compared to traditional designs.Through Hole variant features integrated shielding cans for EMI suppression in dense cellular radio units.Solder process achieves <0.5dB insertion loss variance across production batches.Gold surface treatment prevents fretting corrosion in high-humidity environments.The 10.0µin (0.25µm) coating withstands 500+ thermal shock cycles from -55 C to 125 C.Black housing material demonstrates <0.1% water absorption for marine electronics applications.
Product Attributes
- Product Status: Active
- Connector Type: Header
- Contact Type: Solder Cup
- Number of Positions: 29
- Pitch: 0.079" (2.00mm)
- Number of Rows: 1
- Row Spacing: -
- Mounting Type: Through Hole
- Termination: Solder
- Features: -
- Contact Finish: Gold
- Contact Finish Thickness: 10.0µin (0.25µm)
- Color: Black
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