833-020-541-201

EDAC Inc.

General info

Part Number

833-020-541-201

Manufacturer

EDAC Inc.

Description:

833 HIGH TEMP' SERIES (.156" (3.

Reference Price (USD)

$31.62240

500+

$31.306176

1000+

$30.989952

1500+

$30.673728

2000+

$30.357504

2500+

$30.04128

Exquisite packaging

Discount

TT / Paypal / Credit Card / Western Union / Money Gram

833-020-541-201

$31.62

Product details

Designed for precision interconnect solutions, EDAC Inc.'s 833-020-541-201 Card Edge Connectors - Edgeboard Connectors delivers unmatched reliability in high-vibration environments. Developed for aerospace and defense applications, this connector meets rigorous MIL-SPEC performance requirements.The Non Specified - Dual Edge compatible design features guided card entry. Angulated lead-ins prevent card edge damage during blind mating operations.Female configuration incorporates positive latching mechanism. The over-center latch design requires 25N minimum release force to prevent accidental unmating.With 10 contacts per bay, the connector achieves 98% contact engagement probability. Statistical process controls maintain 0.002" contact position tolerance.The 20 contact arrangement supports redundant power distribution. Parallel power contacts reduce current density by 40% compared to single-contact designs.Accommodating 0.054" ~ 0.070" (1.37mm ~ 1.78mm) cards, the connector features dual-beam contacts. This balanced force design prevents card deformation during insertion.The 2 row configuration includes integrated ground planes. These continuous reference surfaces maintain signal return paths for controlled impedance.0.156" (3.96mm) pitch design enables 56Gbps PAM4 signaling. The air dielectric between contacts minimizes dielectric loss at millimeter-wave frequencies.Dual readout capability supports hot-swap applications. Staggered contact lengths provide make-first/break-last sequencing for safe board insertion.The Through Hole version includes conductive backshell. This Faraday cage design provides 360 EMI shielding effectiveness >60dB at 10GHz.Wire Wrap process creates void-free solder joints. Automated optical inspection (AOI) verifies complete fillet formation on all terminations.The Copper Alloy contacts exhibit excellent thermal conductivity. This property helps dissipate heat generated by contact resistance.Gold plating provides durable wear surface. Micro-hardness testing shows Knoop hardness >200HK for extended mating cycle life.With 10.0µin (0.25µm) gold plating, the contacts achieve <2m contact resistance. This low resistance minimizes voltage drop in power distribution applications.The Cantilever design includes integrated wiping action. Each mating cycle removes surface oxides through 0.5mm of controlled contact wipe.Green housing incorporates radiopaque markers. These features enable X-ray inspection of fully assembled systems.Rated for -40°C ~ 125°C, the connector uses cryogenic-grade materials. Glass transition temperature exceeds maximum operating temperature by 50 C margin.