895-058-525-503
EDAC Inc.
895-058-525-503
EDAC Inc.
895 HIGH TEMP' SERIES (.100" (2.
Reference Price (USD)
1+
$80.45120
500+
$79.646688
1000+
$78.842176
1500+
$78.037664
2000+
$77.233152
2500+
$76.42864
Exquisite packaging
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895-058-525-503
$80.45
Product details
EDAC Inc.'s 895-058-525-503 delivers military-grade reliability in Card Edge Connectors - Edgeboard Connectors for unmanned systems. Developed for harsh environment operation, this connector survives extreme shock, vibration, and environmental exposure.The Non Specified - Dual Edge compatible design features hermetic sealing. When subjected to MIL-STD-810H Method 512.6 procedures, it prevents moisture ingress at 20psi differential pressure.Female configuration includes positive locking. The bayonet coupling requires 15N m torque for disengagement, preventing accidental separation in flight.With 29 contacts per row, the connector achieves 40% weight reduction versus circular designs. The optimized layout maintains signal integrity up to 10Gbps.The 58 contact arrangement supports triple-redundant systems. Each critical signal path has three parallel contacts for fault tolerance.Compatible with 0.054" ~ 0.070" (1.37mm ~ 1.78mm) rigid-flex boards, the connector features floating contacts. This design accommodates 0.8mm board warpage without compromising connection quality.The 2 row architecture includes EMP shielding. The continuous Faraday cage provides 80dB attenuation from 10kHz to 18GHz.0.100" (2.54mm) micro-pitch withstands 100G shock pulses. Finite element analysis confirms zero contact separation during MIL-STD-883 Method 2002 testing.Dual capability supports battlefield diagnostics. The color-coded test points enable quick verification without specialized tools.The Through Hole version includes vibration-resistant features. The tuned mass dampers reduce resonant amplification by 12dB at critical frequencies.Solder process creates cold-welded joints. The diffusion-bonded connections exhibit no intermetallic growth after 1000 thermal cycles.The Copper Alloy contacts survive sand/dust exposure. Testing per MIL-STD-810G Method 510.6 shows <1m resistance change after 50 hours abrasion.Gold plating provides lubricity in vacuum. The dry-film coating maintains <0.2 friction coefficient from sea level to 10-6 torr.With 10.0µin (0.25µm) plating, the contacts resist atomic oxygen erosion. Testing on MISSE-7 confirms <5nm material loss after 18 months LEO exposure.The Cantilever design includes redundant wiping. The dual-scrape mechanism ensures oxide penetration through multiple contact paths.The Black housing meets NATO camouflage requirements. The IR-reflective pigments maintain low observability in 3-5 m and 8-12 m bands.Top Mount Opening, Floating Bobbin, 0.116" (2.95mm) Dia includes quick-disconnect capability. The explosive bolt release allows emergency separation in <50ms.Rated for -40°C ~ 125°C, the connector survives rapid thermal cycling. Testing confirms 500 cycles between -65 C and 150 C with no performance degradation.
Product Attributes
- Product Status: Active
- Card Type: Non Specified - Dual Edge
- Gender: Female
- Number of Positions/Bay/Row: 29
- Number of Positions: 58
- Card Thickness: 0.054" ~ 0.070" (1.37mm ~ 1.78mm)
- Number of Rows: 2
- Pitch: 0.100" (2.54mm)
- Read Out: Dual
- Features: -
- Mounting Type: Through Hole
- Termination: Solder
- Contact Material: Copper Alloy
- Contact Finish: Gold
- Contact Finish Thickness: 10.0µin (0.25µm)
- Contact Type: Cantilever
- Color: Black
- Flange Feature: Top Mount Opening, Floating Bobbin, 0.116" (2.95mm) Dia
- Operating Temperature: -40°C ~ 125°C
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