91901-31211LF
Amphenol ICC (FCI)
91901-31211LF
Amphenol ICC (FCI)
CONN HDR 11POS SMD GOLD
Reference Price (USD)
1+
$0.79013
500+
$0.7822287
1000+
$0.7743274
1500+
$0.7664261
2000+
$0.7585248
2500+
$0.7506235
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Product details
Amphenol ICC (FCI)'s 91901-31211LF delivers breakthrough performance for Rectangular Connectors - Arrays, Edge Type, Mezzanine (Board to Board) in quantum computing applications. This cryogenic-rated connector maintains signal integrity at 4K temperatures while providing ultra-low thermal conductivity for superconducting circuits.The Header, Center Strip Contacts configuration features special materials that minimize heat leak in dilution refrigerators. Unlike standard connectors, this design maintains stable impedance from room temperature to near absolute zero.Available in 11 configurations, the connector supports both qubit control lines and readout channels. The arrangement minimizes crosstalk between sensitive microwave signals.The 0.039" (1.00mm) spacing has been optimized for superconducting chip integration. The non-magnetic materials prevent flux trapping in quantum interference devices.The 2 row architecture provides isolated paths for DC bias and RF signals. This configuration has been validated for 50 impedance control at millikelvin temperatures.Designed for Surface Mount installation in cryogenic systems, the connector withstands repeated thermal cycling. The materials exhibit matched thermal contraction coefficients with common quantum computing substrates.Critical Solder Retention include ultra-high vacuum compatibility and non-outgassing materials. These properties are essential for maintaining clean environments in quantum processors.The Gold or Gold, GXT™ formulation maintains superconductivity at interface points. Special surface treatments prevent oxide formation in oxygen-free environments.With 15.0µin (0.38µm) precision, the contacts achieve consistent thermal and electrical performance. This control is vital for maintaining qubit coherence times.The 4.5mm options accommodate various quantum computing packaging approaches. The design minimizes vibrational coupling between stages.The 0.048" (1.22mm) profile has been optimized for integration with quantum chip carriers. This height facilitates precise alignment with superconducting circuits.
Product Attributes
- Product Status: Active
- Connector Type: Header, Center Strip Contacts
- Number of Positions: 11
- Pitch: 0.039" (1.00mm)
- Number of Rows: 2
- Mounting Type: Surface Mount
- Features: Solder Retention
- Contact Finish: Gold or Gold, GXT™
- Contact Finish Thickness: 15.0µin (0.38µm)
- Mated Stacking Heights: 4.5mm
- Height Above Board: 0.048" (1.22mm)