91932-31169LF

The 91932-31169LF from Amphenol ICC (FCI) sets new benchmarks for Rectangular Connectors - Arrays, Edge Type, Mezzanine (Board to Board) in renewable energy systems. This high-current connector solution is engineered for photovoltaic inverters and energy storage applications, featuring industry-leading 1000VAC/1500VDC voltage ratings.Featuring a Receptacle, Outer Shroud Contacts design, this connector achieves 250A continuous current capacity. The arc-resistant housing meets UL 4128 standards for renewable energy applications.With 69 configurations available, the connector supports various power conversion topologies. The optimized layout minimizes parasitic inductance in high-di/dt applications.The 0.039" (1.00mm) spacing has been engineered for creepage and clearance requirements in high-voltage systems. The design exceeds IEC 62109-1 safety standards for photovoltaic equipment.The 2 row configuration provides balanced current sharing between parallel contacts. This arrangement reduces hot-spot formation in continuous operation.Developed for Surface Mount installation, the connector features quick-lock mechanisms for field maintenance. The design withstands UV exposure and salt spray per IEC 61701.Key Board Guide, Solder Retention include integrated temperature monitoring and arc-fault detection. These smart features enable predictive maintenance in solar farms.The Gold or Gold, GXT™ technology prevents fretting corrosion in vibrating environments. Testing shows less than 0.5mV contact potential difference after 10,000 thermal cycles.With 15.0µin (0.38µm) protection, the contacts maintain low resistance under 200A loads. This specification is critical for minimizing power losses in energy systems.The 4.15mm, 4.5mm, 5mm, 5.5mm, 6mm, 7mm, 7.52mm options accommodate various cabinet designs in utility-scale installations. The stackable configuration supports modular power conversion systems.The 0.129" (3.28mm) profile allows for proper airflow in enclosed inverters. This design consideration improves thermal management in high-power applications.