973027
TE Connectivity Erni
Product details
The 973027 by TE Connectivity Erni revolutionizes Backplane Connectors - Specialized technology, specifically engineered for hyperscale data center applications. This high-density interconnect solution delivers unmatched signal integrity while supporting next-generation computing architectures.Featuring Header, Male Pins configuration, this connector series provides optimal performance for 224G PAM4 signaling in switch fabric applications.With 90 available positions, this solution enables unprecedented port density for top-of-rack switching equipment.The All loaded variant offers power-efficient solutions for partial population scenarios in server backplanes.The 0.098" (2.50mm) micro-pitch design enables breakthrough density while maintaining impedance control for 112G SerDes channels.9 row configuration supports orthogonal direct-attach copper architectures in disaggregated server designs.The 10 column architecture enables efficient routing of wide parallel buses in memory-centric computing systems.Through Hole installation method ensures precise coplanarity for reliable surface-mount assembly in automated PCB production lines.The Press-Fit process has been optimized for low-void solder joints in mass reflow processes per IPC-7095C standards.The 60 Signal, 30 Ground arrangement implements optimized return current paths essential for reducing simultaneous switching noise in AI accelerator cards.Gold plating technology provides superior wear resistance exceeding 10,000 mating cycles for data center hot-swap scenarios.
Product Attributes
- Product Status: Active
- Connector Usage: -
- Connector Type: Header, Male Pins
- Connector Style: -
- Number of Positions: 90
- Number of Positions Loaded: All
- Pitch: 0.098" (2.50mm)
- Number of Rows: 9
- Number of Columns: 10
- Mounting Type: Through Hole
- Termination: Press-Fit
- Contact Layout, Typical: 60 Signal, 30 Ground
- Features: -
- Contact Finish: Gold
- Contact Finish Thickness: -
- Color: -