A-TB508-HG19

Designed for precision instrumentation, Assmann WSW Components's A-TB508-HG19 delivers exceptional performance in Terminal Blocks - Wire to Board applications. This laboratory-grade terminal block ensures measurement accuracy through ultra-low contact resistance and superior signal integrity. The 510KBA-BAAG is particularly suited for test equipment, medical devices, and scientific instrumentation requiring reliable low-noise connections.The 1 configuration minimizes parallel capacitance effects in sensitive circuits. Isolated level construction reduces crosstalk to <0.1pF between adjacent channels.With 19 precision contacts, the block accommodates high-channel-count measurements. Each position features beryllium copper contacts with <1m resistance variation.0.200" (5.08mm) spacing eliminates parallel resonance effects up to 1GHz. The precision-molded slots maintain consistent impedance for high-frequency signals.45° (135°) Angle with Board alignment facilitates ergonomic probe access during testing. The angled options enable clean cable management in rack-mounted systems.The 15 A rating supports both signal and power distribution needs. Gold-over-nickel plating ensures stable contact resistance even at microamp measurement levels.Rated for 300 V isolation, the block prevents leakage currents from affecting sensitive measurements. The PTFE insulation material exhibits <0.001% dielectric absorption.Accepting 12-28 AWG precision wires, the termination preserves conductor integrity. The non-magnetic contact materials prevent thermocouple effects in low-voltage circuits.Through Hole installation ensures stable grounding for noise-sensitive applications. The mounting interface incorporates RFI shielding gaskets for electromagnetic compatibility.The Screwless mechanism prevents conductor damage during repeated reconfigurations. The tool-less design maintains consistent clamping force within 5% tolerance.Interlocking (Side) include ESD protection up to 15kV. The static-dissipative housing material prevents charge buildup that could affect sensitive components.