A10548-08

The A10548-08 by Laird Technologies - Thermal Materials revolutionizes Thermal - Adhesives, Epoxies, Greases, Pastes applications through its scientifically formulated thermal management properties. Optimized for high-reliability systems, this material delivers unparalleled thermal transfer efficiency while simplifying manufacturing processes.This Silicone Putty thermal interface material incorporates nanotechnology-enhanced fillers. Compared to conventional formulations, it provides 25% better surface conformity while requiring 40% less application pressure for optimal bonding.Packaged in 25cc Jar quantities, this product accommodates diverse production scales. The ergonomic container design facilitates both manual application and automated dispensing systems.Performance remains stable across -49°F ~ 392°F (-45°C ~ 200°C), making it ideal for automotive under-hood applications. The material's thermal resistance coefficient shows less than 5% variation throughout this spectrum.The White hue serves multiple purposes: application verification and UV degradation monitoring. This dual-function pigmentation system enhances quality control in outdoor electronics applications.Achieving 3.00W/m-K thermal conductivity, this material reduces thermal interface resistance by up to 35%. Its optimized particle distribution creates efficient heat transfer pathways without increasing mechanical stress.The Low Outgassing (ASTM E595) formulation addresses critical requirements in telecommunications infrastructure. These specialized properties prevent performance degradation in high-humidity environments while maintaining signal integrity.With 24 Months shelf life, this product offers extended usability windows. Proper storage at {Storage/Refrigeration Temperature} maintains the material's dielectric properties and application characteristics.