A15819-04

The A15819-04 from Laird Technologies - Thermal Materials represents a technological leap in Thermal - Adhesives, Epoxies, Greases, Pastes, specifically formulated for next-generation thermal management solutions. This high-performance material combines exceptional thermal transfer capabilities with outstanding reliability for mission-critical applications.This Silicone Compound thermal interface material incorporates advanced polymer technology. Unlike conventional compounds, its viscoelastic properties adapt to thermal expansion differentials, maintaining optimal interface pressure throughout {Usable Temperature Range}.Engineered for 257°F (125°C) operation, this material demonstrates exceptional stability. Testing shows less than 3% thermal resistance variation after 1000 cycles, making it ideal for industrial automation systems.White coloration provides immediate visual confirmation of proper application. This quality assurance feature is particularly valuable in high-reliability applications where inspection access is limited.Delivering 1.20W/m-K thermal conductivity, this compound outperforms standard materials by 30-35%. Its optimized filler distribution creates efficient thermal pathways without compromising dielectric strength.The Low Outgassing (ASTM E595) formulation meets stringent requirements for military and aerospace applications. These specialized properties ensure reliable performance in extreme environmental conditions while preventing outgassing.