A17669-016
Laird Technologies - Thermal Materials
A17669-016
Laird Technologies - Thermal Materials
TFLEX UT20400 18" X 18"
Reference Price (USD)
1+
$104.93000
500+
$103.8807
1000+
$102.8314
1500+
$101.7821
2000+
$100.7328
2500+
$99.6835
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
A17669-016
$104.93
Product details
Laird Technologies - Thermal Materials's A17669-016 establishes new standards in Thermal - Pads, Sheets for renewable energy systems. This high-efficiency thermal solution is engineered specifically for solar inverters and wind turbine power electronics, delivering unmatched reliability in green energy applications.As an environmentally certified Gap Filler Pad, Sheet, this product combines superior thermal transfer with RoHS-compliant materials. The halogen-free composition makes it ideal for sustainable energy applications requiring eco-friendly components.Available in Square configurations, this solution accommodates large-area power modules. The precision-cut profiles ensure optimal coverage of IGBT and MOSFET packages in high-power converters.With 457.20mm x 457.20mm dimensions, this thermal pad fits standard renewable energy enclosure designs. The optimized footprint allows for efficient thermal pathway creation in space-constrained power cabinets.The carefully engineered 0.0160" (0.406mm) provides perfect balance between thermal transfer and vibration damping. This characteristic is particularly valuable in wind turbine applications subject to constant mechanical stress.Constructed from weather-resistant Silicone, Ceramic Filled, this pad exhibits exceptional performance in humid environments. The hydrophobic formulation prevents moisture absorption that could degrade thermal performance.The Gray identification system facilitates quick material verification during field maintenance. This outdoor-visible coloring remains legible even after years of environmental exposure.Achieving 3.0W/m-K performance, this material enables more efficient cooling of power semiconductors. The isotropic properties ensure uniform heat distribution across large-area devices.
Product Attributes
- Product Status: Active
- Usage: -
- Type: Gap Filler Pad, Sheet
- Shape: Square
- Outline: 457.20mm x 457.20mm
- Thickness: 0.0160" (0.406mm)
- Material: Silicone, Ceramic Filled
- Adhesive: -
- Backing, Carrier: -
- Color: Gray
- Thermal Resistivity: -
- Thermal Conductivity: 3.0W/m-K
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